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參數(shù)資料
| 型號： | 74AUC1G08GV |
| 廠商： | NXP SEMICONDUCTORS |
| 元件分類： | 通用總線功能 |
| 英文描述： | Single 2-input AND gate |
| 中文描述： | AUC SERIES, 2-INPUT AND GATE, PDSO5 |
| 封裝： | PLASTIC, SOT-753, 5 PIN |
| 文件頁數(shù)： | 11/12頁 |
| 文件大?。?/td> | 50K |
| 代理商： | 74AUC1G08GV |
2002 Nov 12
11
Philips Semiconductors
Preliminary specification
Single 2-input NAND gate
74AUC1G00
Suitability of surface mount IC packages for wave and reflow soldering methods
Notes
1.
All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”
These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink
(at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).
If wave soldering is considered, then the package must be placed at a 45
°
angle to the solder wave direction.
The package footprint must incorporate solder thieves downstream and at the side corners.
Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm;
it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
2.
3.
4.
5.
PACKAGE
SOLDERING METHOD
WAVE
REFLOW
(1)
BGA, HBGA, LFBGA, SQFP, TFBGA
HBCC, HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, HVQFN, SMS
PLCC
(3)
, SO, SOJ
LQFP, QFP, TQFP
SSOP, TSSOP, VSO
not suitable
not suitable
(2)
suitable
not recommended
(3)(4)
not recommended
(5)
suitable
suitable
suitable
suitable
suitable
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| 74AUC1G08GW | Single 2-input AND gate |
| 74AUC1G02 | 74AUC1G02 Single 2-input NOR gate |
| 74AUC1G02GV | 74AUC1G02 Single 2-input NOR gate |
| 74AUC1G02GW | 74AUC1G02 Single 2-input NOR gate |
| 74AUC1G00 | Single 2-input NAND gate |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| 74AUC1G08GW | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Single 2-input AND gate |
| 74AUC1G125DBVRE4 | 功能描述:緩沖器和線路驅(qū)動器 Single Bus Buffer Gate RoHS:否 制造商:Micrel 輸入線路數(shù)量:1 輸出線路數(shù)量:2 極性:Non-Inverting 電源電壓-最大:+/- 5.5 V 電源電壓-最小:+/- 2.37 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:MSOP-8 封裝:Reel |
| 74AUC1G125DBVRG4 | 功能描述:緩沖器和線路驅(qū)動器 Single Bus Buffer Gate RoHS:否 制造商:Micrel 輸入線路數(shù)量:1 輸出線路數(shù)量:2 極性:Non-Inverting 電源電壓-最大:+/- 5.5 V 電源電壓-最小:+/- 2.37 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:MSOP-8 封裝:Reel |
| 74AUC1G125DCKRE4 | 功能描述:緩沖器和線路驅(qū)動器 Single Bus Buffer Gate RoHS:否 制造商:Micrel 輸入線路數(shù)量:1 輸出線路數(shù)量:2 極性:Non-Inverting 電源電壓-最大:+/- 5.5 V 電源電壓-最小:+/- 2.37 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:MSOP-8 封裝:Reel |
| 74AUC1G125DCKRG4 | 功能描述:緩沖器和線路驅(qū)動器 Single Bus Buffer Gate RoHS:否 制造商:Micrel 輸入線路數(shù)量:1 輸出線路數(shù)量:2 極性:Non-Inverting 電源電壓-最大:+/- 5.5 V 電源電壓-最小:+/- 2.37 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:MSOP-8 封裝:Reel |
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