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參數(shù)資料
| 型號： | 74ALVC374 |
| 廠商： | NXP Semiconductors N.V. |
| 英文描述： | Quadruple Bus Buffer Gates With 3-State Outputs 14-PDIP -40 to 85 |
| 中文描述： | 八路D型觸發(fā)器上升沿觸發(fā) |
| 文件頁數(shù)： | 16/20頁 |
| 文件大小： | 94K |
| 代理商： | 74ALVC374 |
2002 Feb 26
16
Philips Semiconductors
Product specification
Octal D-type flip-flop; positive edge-trigger;
3-state
74ALVC374
Suitability of surface mount IC packages for wave and reflow soldering methods
Notes
1.
All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”
These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink
(at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).
If wave soldering is considered, then the package must be placed at a 45
°
angle to the solder wave direction.
The package footprint must incorporate solder thieves downstream and at the side corners.
Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm;
it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
2.
3.
4.
5.
PACKAGE
SOLDERING METHOD
WAVE
REFLOW
(1)
BGA, LFBGA, SQFP, TFBGA
HBCC, HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, SMS
PLCC
(3)
, SO, SOJ
LQFP, QFP, TQFP
SSOP, TSSOP, VSO
not suitable
not suitable
(2)
suitable
not recommended
(3)(4)
not recommended
(5)
suitable
suitable
suitable
suitable
suitable
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| 74ALVC74 | Dual D-type flip-flop with set and reset; positive-edge trigger |
| 74ALVCH162244 | 16-bit buffer/line driver with 30Ω termination resistor (3-State)(帶30Ω終端電阻器的16位緩沖器/線驅(qū)動器（三態(tài)）) |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| 74ALVC374BQ | 制造商:NXP Semiconductors 功能描述:IC OCT EDGE-TRG D-TYP F-F DH |
| 74ALVC374BQ,115 | 功能描述:觸發(fā)器 3.3V OCT D SET/RESET RoHS:否 制造商:Texas Instruments 電路數(shù)量:2 邏輯系列:SN74 邏輯類型:D-Type Flip-Flop 極性:Inverting, Non-Inverting 輸入類型:CMOS 輸出類型: 傳播延遲時間:4.4 ns 高電平輸出電流:- 16 mA 低電平輸出電流:16 mA 電源電壓-最大:5.5 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:X2SON-8 封裝:Reel |
| 74ALVC374BQ-G | 功能描述:觸發(fā)器 3.3V OCT D SET/RESET TRIG RoHS:否 制造商:Texas Instruments 電路數(shù)量:2 邏輯系列:SN74 邏輯類型:D-Type Flip-Flop 極性:Inverting, Non-Inverting 輸入類型:CMOS 輸出類型: 傳播延遲時間:4.4 ns 高電平輸出電流:- 16 mA 低電平輸出電流:16 mA 電源電壓-最大:5.5 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:X2SON-8 封裝:Reel |
| 74ALVC374D | 功能描述:觸發(fā)器 3.3V D-TYPE +EDGE TRIG 3S RoHS:否 制造商:Texas Instruments 電路數(shù)量:2 邏輯系列:SN74 邏輯類型:D-Type Flip-Flop 極性:Inverting, Non-Inverting 輸入類型:CMOS 輸出類型: 傳播延遲時間:4.4 ns 高電平輸出電流:- 16 mA 低電平輸出電流:16 mA 電源電壓-最大:5.5 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:X2SON-8 封裝:Reel |
| 74ALVC374D,112 | 功能描述:觸發(fā)器 3.3V D-TYPE +EDGE RoHS:否 制造商:Texas Instruments 電路數(shù)量:2 邏輯系列:SN74 邏輯類型:D-Type Flip-Flop 極性:Inverting, Non-Inverting 輸入類型:CMOS 輸出類型: 傳播延遲時間:4.4 ns 高電平輸出電流:- 16 mA 低電平輸出電流:16 mA 電源電壓-最大:5.5 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:X2SON-8 封裝:Reel |
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