參數(shù)資料
型號: 74ALVC16838MTDX
英文描述: BUFFER/FLIP-FLOP|AVC/ALVC-CMOS|TSSOP|48PIN|PLASTIC
中文描述: 緩沖區(qū)/觸發(fā)器|的AVC / ALVC全CMOS | TSSOP封裝| 48PIN |塑料
文件頁數(shù): 5/5頁
文件大?。?/td> 53K
代理商: 74ALVC16838MTDX
5
www.fairchildsemi.com
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Physical Dimensions
inches (millimeters) unless otherwise noted (Continued)
14-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide
Package Number MTC14
Fairchild does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and
Fairchild reserves the right at any time without notice to change said circuitry and specifications.
LIFE SUPPORT POLICY
FAIRCHILD
S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD
SEMICONDUCTOR CORPORATION. As used herein:
1. Life support devices or systems are devices or systems
which, (a) are intended for surgical implant into the
body, or (b) support or sustain life, and (c) whose failure
to perform when properly used in accordance with
instructions for use provided in the labeling, can be rea-
sonably expected to result in a significant injury to the
user.
2. A critical component in any component of a life support
device or system whose failure to perform can be rea-
sonably expected to cause the failure of the life support
device or system, or to affect its safety or effectiveness.
www.fairchildsemi.com
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