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參數(shù)資料
| 型號： | 74AHC377 |
| 廠商： | NXP Semiconductors N.V. |
| 英文描述： | Octal D-type flip-flop with data enable; positive-edge trigger |
| 中文描述： | 八路D型觸發(fā)器數(shù)據(jù)使觸發(fā)器，積極邊緣觸發(fā) |
| 文件頁數(shù)： | 16/20頁 |
| 文件大?。?/td> | 101K |
| 代理商： | 74AHC377 |
2000 Aug 15
16
Philips Semiconductors
Product specification
Octal D-type flip-flop with data enable;
positive-edge trigger
74AHC377; 74AHCT377
Suitability of surface mount IC packages for wave and reflow soldering methods
Notes
1.
All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”
These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink
(at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).
If wave soldering is considered, then the package must be placed at a 45
°
angle to the solder wave direction.
The package footprint must incorporate solder thieves downstream and at the side corners.
Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm;
it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
2.
3.
4.
5.
PACKAGE
SOLDERING METHOD
WAVE
REFLOW
(1)
BGA, SQFP
HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, SMS
PLCC
(3)
, SO, SOJ
LQFP, QFP, TQFP
SSOP, TSSOP, VSO
not suitable
not suitable
(2)
suitable
not recommended
(3)(4)
not recommended
(5)
suitable
suitable
suitable
suitable
suitable
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| 74AHC377_08 | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Octal D-type flip-flop with data enable; positive-edge trigger |
| 74AHC377D | 功能描述:觸發(fā)器 OCT D-TYPE EDGE TRIGGER RoHS:否 制造商:Texas Instruments 電路數(shù)量:2 邏輯系列:SN74 邏輯類型:D-Type Flip-Flop 極性:Inverting, Non-Inverting 輸入類型:CMOS 輸出類型: 傳播延遲時間:4.4 ns 高電平輸出電流:- 16 mA 低電平輸出電流:16 mA 電源電壓-最大:5.5 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:X2SON-8 封裝:Reel |
| 74AHC377D,112 | 功能描述:觸發(fā)器 OCT D-TYPE EDGE RoHS:否 制造商:Texas Instruments 電路數(shù)量:2 邏輯系列:SN74 邏輯類型:D-Type Flip-Flop 極性:Inverting, Non-Inverting 輸入類型:CMOS 輸出類型: 傳播延遲時間:4.4 ns 高電平輸出電流:- 16 mA 低電平輸出電流:16 mA 電源電壓-最大:5.5 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:X2SON-8 封裝:Reel |
| 74AHC377D,118 | 功能描述:觸發(fā)器 OCT D-TYPE EDGE RoHS:否 制造商:Texas Instruments 電路數(shù)量:2 邏輯系列:SN74 邏輯類型:D-Type Flip-Flop 極性:Inverting, Non-Inverting 輸入類型:CMOS 輸出類型: 傳播延遲時間:4.4 ns 高電平輸出電流:- 16 mA 低電平輸出電流:16 mA 電源電壓-最大:5.5 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:X2SON-8 封裝:Reel |
| 74AHC377D-Q100J | 功能描述:IC D-TYPE POS TRG SNGL 20SOIC 制造商:nxp semiconductors 系列:汽車級，AEC-Q100，74AHC 包裝:帶卷（TR） 零件狀態(tài):有效 功能:標(biāo)準(zhǔn) 類型:D 型 輸出類型:非反相 元件數(shù):1 每元件位數(shù):8 頻率 - 時鐘:120MHz 不同 V，最大 CL 時的最大傳播延遲:10.5ns @ 5V，50pF 觸發(fā)器類型:正邊沿 電流 - 輸出高，低:8mA，8mA 電壓 - 電源:2 V ~ 5.5 V 電流 - 靜態(tài):4μA 輸入電容:3pF 工作溫度:-40°C ~ 125°C（TA） 安裝類型:表面貼裝 封裝/外殼:20-SOIC（0.295"，7.50mm 寬） 標(biāo)準(zhǔn)包裝:2,000 |
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