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參數(shù)資料
| 型號： | 74AHC1G07 |
| 廠商： | NXP Semiconductors N.V. |
| 英文描述： | 32-Bit LVTTL-to-GTLP Bus Transceiver 96-LFBGA -40 to 85 |
| 中文描述： | 32 位 LVTTL-GTLP 總線收發(fā)器 96-LFBGA 工作溫度-40℃到85℃ |
| 文件頁數(shù)： | 12/16頁 |
| 文件大?。?/td> | 74K |
| 代理商： | 74AHC1G07 |
2002 May 27
12
Philips Semiconductors
Product specification
2-input NAND gate
74AHC1G00; 74AHCT1G00
SOLDERING
Introduction to soldering surface mount packages
Thistextgivesaverybriefinsighttoacomplextechnology.
A more in-depth account of soldering ICs can be found in
our “Data Handbook IC26; Integrated Circuit Packages”
(document order number 9398 652 90011).
There is no soldering method that is ideal for all surface
mount IC packages. Wave soldering can still be used for
certainsurfacemountICs,butitisnotsuitableforfinepitch
SMDs. In these situations reflow soldering is
recommended.
Reflow soldering
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
Several methods exist for reflowing; for example,
convection or convection/infrared heating in a conveyor
type oven. Throughput times (preheating, soldering and
cooling) vary between 100 and 200 seconds depending
on heating method.
Typical reflow peak temperatures range from
215 to 250
°
C. The top-surface temperature of the
packages should preferable be kept below 220
°
C for
thick/large packages, and below 235
°
C for small/thin
packages.
Wave soldering
Conventional single wave soldering is not recommended
forsurfacemountdevices(SMDs)orprinted-circuitboards
with a high component density, as solder bridging and
non-wetting can present major problems.
To overcome these problems the double-wave soldering
method was specifically developed.
If wave soldering is used the following conditions must be
observed for optimal results:
Use a double-wave soldering method comprising a
turbulent wave with high upward pressure followed by a
smooth laminar wave.
For packages with leads on two sides and a pitch (e):
– larger than or equal to 1.27 mm, the footprint
longitudinal axis is
preferred
to be parallel to the
transport direction of the printed-circuit board;
– smaller than 1.27 mm, the footprint longitudinal axis
must
be parallel to the transport direction of the
printed-circuit board.
The footprint must incorporate solder thieves at the
downstream end.
Forpackageswithleadsonfoursides,thefootprintmust
be placed at a 45
°
angle to the transport direction of the
printed-circuit board. The footprint must incorporate
solder thieves downstream and at the side corners.
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
Typical dwell time is 4 seconds at 250
°
C.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
Manual soldering
Fix the component by first soldering two
diagonally-opposite end leads. Use a low voltage (24 V or
less) soldering iron applied to the flat part of the lead.
Contact time must be limited to 10 seconds at up to
300
°
C.
When using a dedicated tool, all other leads can be
soldered in one operation within 2 to 5 seconds between
270 and 320
°
C.
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相關代理商/技術參數(shù) |
參數(shù)描述 |
|---|---|
| 74AHC1G07GV | 功能描述:緩沖器和線路驅動器 HEX BUFFER/DRIVER RoHS:否 制造商:Micrel 輸入線路數(shù)量:1 輸出線路數(shù)量:2 極性:Non-Inverting 電源電壓-最大:+/- 5.5 V 電源電壓-最小:+/- 2.37 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:MSOP-8 封裝:Reel |
| 74AHC1G07GV,125 | 功能描述:緩沖器和線路驅動器 HEX BUFFER/DRIVER RoHS:否 制造商:Micrel 輸入線路數(shù)量:1 輸出線路數(shù)量:2 極性:Non-Inverting 電源電壓-最大:+/- 5.5 V 電源電壓-最小:+/- 2.37 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:MSOP-8 封裝:Reel |
| 74AHC1G07GV-Q100H | 功能描述:IC BUFFER NONINV O/D 5TSOP 制造商:nexperia usa inc. 系列:汽車級，AEC-Q100，74AHC 包裝:剪切帶（CT） 零件狀態(tài):在售 邏輯類型:緩沖器，非反向 元件數(shù):1 每元件位數(shù):1 輸入類型:- 輸出類型:開路漏極 電流 - 輸出高，低:-，8mA 電壓 - 電源:2 V ~ 5.5 V 工作溫度:-40°C ~ 125°C（TA） 安裝類型:表面貼裝 封裝/外殼:SC-74A，SOT-753 供應商器件封裝:5-TSOP 標準包裝:1 |
| 74AHC1G07GW | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Buffer with open-drain output |
| 74AHC1G07GW,125 | 功能描述:緩沖器和線路驅動器 HEX BUFFER/DRIVER RoHS:否 制造商:Micrel 輸入線路數(shù)量:1 輸出線路數(shù)量:2 極性:Non-Inverting 電源電壓-最大:+/- 5.5 V 電源電壓-最小:+/- 2.37 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:MSOP-8 封裝:Reel |
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