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    參數(shù)資料
    型號: 7178DG
    廠商: Aavid Thermalloy
    文件頁數(shù): 90/116頁
    文件大小: 0K
    描述: BOARD LEVEL HEAT SINK
    產(chǎn)品培訓模塊: How to Select a Heat Sink
    標準包裝: 1,000
    類型: 插件板級,垂直
    冷卻式包裝: TO-220
    固定方法: 螺栓固定和 PC 引腳
    形狀: 矩形
    長度: 0.750"(19.05mm)
    寬: 0.520"(13.21mm)
    機座外的高度(散熱片高度): 0.375"(9.52mm)
    溫升時的功耗: 0.6W @ 30°C
    在強制氣流下的熱敏電阻: 在 700 LFM 時為5.0°C/W
    自然環(huán)境下的熱電阻: 35.7°C/W
    材質(zhì):
    材料表面處理:
    其它名稱: 043244
    75
    THRU
    HOLE
    DISCRETE
    SEMIC
    O
    NDUCT
    O
    R
    P
    A
    C
    K
    A
    GES
    EUROPE
    ASIA
    Italy Tel: +39 051 764011 email: sales.it@aavid.com
    United Kingdom Tel: +44 1793 401400 email: sales.uk@aavid.com
    Singapore Tel: +65 6362 8388 email: sales@aavid.com.sg
    Taiwan Tel: +886(2) 2698-9888 email: sales@aavid.com.tw
    AMERICA
    USA Tel: +1 (603) 224-9988 email: info@aavid.com
    www.aavidthermalloy.com
    ORDERING INFORMATION
    6.35
    (0.250)
    10.03
    (0.395)
    21.08
    (0.830)
    8.03
    (0.316)
    "A"
    Part Number
    “A” Dim
    578105B00000G
    3.96 (0.156)
    578205B00000G
    6.35 (0.250)
    578305B00000G
    12.70 (0.500)
    578405B00000G
    19.05 (0.750)
    578505B00000G
    25.40 (1.000)
    Air Velocity—Feet Per Minute
    Heat Dissipated—Watts
    Th
    ermal
    Resistanc
    eF
    rom
    MT
    G
    Sur
    fac
    et
    oAmbien
    t—°C/W
    at
    t
    50
    0
    20
    40
    60
    80
    100
    0.0
    0.4
    0.8
    1.2
    1.6
    2.0
    40
    30
    10
    20
    0
    400
    200
    600
    800
    1000
    578205
    578105
    Moun
    ting
    Sur
    fac
    eT
    emp
    Ri
    se
    A
    bo
    ve
    Ambien
    t—°C
    Snap on cooler features easy
    no tools installation. Folded
    back fins provide maximum
    surface area while preserving
    valuable board space.
    5781, 5782, 5783, 5784, 5785
    Snap on cooler heat sink
    6201, 6202, 6203
    Space saving expandable heat sink
    features a collar that tightly grips the
    device meaning no extra hardware is
    required. Heat sinks are constructed of
    pre-black anodize material to lower cost.
    Air Velocity—Feet Per Minute
    Heat Dissipated—Watts
    Th
    ermal
    Resistanc
    eF
    rom
    MT
    G
    Sur
    fac
    et
    oAmbien
    t—
    °C/W
    at
    t
    50
    0
    20
    40
    60
    80
    100
    0.0
    0.4
    0.8
    1.2
    1.6
    2.0
    40
    30
    10
    20
    0
    400
    200
    600
    800
    1000
    6202
    6201
    Moun
    ting
    Sur
    fac
    eT
    emp
    Ri
    se
    A
    bo
    ve
    Ambien
    t—
    °C
    6203
    32.51
    (1.280)
    6.35
    (0.250)
    8.03
    (0.316)
    I.D.
    "A"
    Part Number
    “A” Dim
    # Fins
    6201PBG
    6.35 (0.250)
    1
    6202PBG
    12.70 (0.500)
    2
    6203PBG
    19.56 (0.770)
    3
    ORDERING INFORMATION
    Material: 0.63 (0.025) Thick Aluminum
    Finish: Black Anodize
    Material: 0.63 (0.025) Thick Aluminum
    Finish: Pre Black Anodize*
    TO-05 Heat Sinks
    * Edges cut during the manufacturing process will be unfinished.
    See page 110 more more information
    Air Velocity—Feet Per Minute
    Heat Dissipated—Watts
    Th
    ermal
    Resistanc
    eF
    rom
    MT
    G
    Sur
    fac
    et
    oAmbien
    t—°C/W
    at
    t
    50
    0
    20
    40
    60
    80
    100
    0.0
    0.4
    0.8
    1.2
    1.6
    2.0
    40
    30
    10
    20
    0
    400
    200
    600
    800
    1000
    578405
    Moun
    ting
    Sur
    fac
    eT
    emp
    Ri
    se
    A
    bo
    ve
    Ambien
    t—°C
    578305
    Air Velocity—Feet Per Minute
    Heat Dissipated—Watts
    Thermal
    Resistance
    From
    MTG
    Surface
    to
    Ambient—
    °
    C/Watt
    50
    0
    20
    40
    60
    80
    100
    0.0
    0.4
    0.8
    1.2
    1.6
    2.0
    40
    30
    10
    20
    0
    400
    200
    600
    800
    1000
    Mounting
    Surface
    Temp
    Rise
    Above
    Ambient—
    °
    C
    578505
    5F
    Low cost push on heat sink
    12.70
    (0.500)
    16.00
    (0.630)
    7.90
    (0.311)
    Air VelocityFeet Per Minute
    Heat DissipatedWatts
    Th
    ermal
    Resistanc
    eF
    rom
    MT
    G
    Sur
    fac
    et
    oAmbien
    t—°
    C/W
    at
    t
    50
    0
    20
    40
    60
    80
    100
    0
    0.5
    1
    1.5
    2
    2.5
    40
    30
    10
    20
    0
    400
    200
    600
    800
    1000
    Moun
    ting
    Sur
    fac
    eT
    emp
    Rise
    A
    bo
    ve
    Ambien
    t—°
    C
    Part Number
    Description
    5FG
    Low cost push on heat sink
    ORDERING INFORMATION
    Material: Aluminum
    Finish: Black Anodize
    Low cost push on heat sink
    uses spring pressure to firmly
    grip the device case creating
    a good thermal interface.
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