參數(shù)資料
型號: 5962R9956002TXC
英文描述: Dual MOSFET Driver
中文描述: 雙MOSFET驅(qū)動器
文件頁數(shù): 3/41頁
文件大?。?/td> 290K
代理商: 5962R9956002TXC
SIZE
A
5962-94663
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
REVISION LEVEL
D
SHEET
3
DSCC FORM 2234
APR 97
1.2.3 Device class designator. The device class designator is a single letter identifying the product assurance level as
follows:
Device class
Device requirements documentation
M
Vendor self-certification to the requirements for MIL-STD-883 compliant,
non-JAN class level B microcircuits in accordance with MIL-PRF-38535,
appendix A
Q or V
Certification and qualification to MIL-PRF-38535
1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows:
Outline letter
Descriptive designator
Terminals
Package style
X
Y
See figure 1
See figure 1
100
100
Pin grid array 1/
Leaded chip carrier with
nonconductive tier bar
1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535,
appendix A for device class M.
1.3 Absolute maximum ratings. 2/
Storage temperature range (T
STG
) .................................................................... -65
°
C to +150
°
C
Operating case temperature range (T
C
) ............................................................ -55
°
C to +125
°
C
Transceiver supply voltage (V
EE
):
Device types 01, 03, 04, 06, 07, 09, 10 ......................................................... -22 V dc
Transceiver supply voltage range (V
CC
):
Device types 02, 05, 08, 11 .......................................................................... -0.3 V dc to +7.0 V dc
Logic supply voltage range (V
DD
)....................................................................... -0.3 V dc to +7.0 V dc
Input voltage range (V
DR
):
Device types 01, 03, 04, 06, 07, 09, 10 ......................................................... 42 V
P,L-L
Device types 02, 05, 08, 11 .......................................................................... 10 V
P,L-L
Maximum power dissipation (P
D
)....................................................................... 5 W
Logic voltage on any pin range (V
I/O
)................................................................. -0.3 V dc to V
DD
+ 0.3 V dc
Logic latch-up immunity (I
LU
).............................................................................
±
150 mA
Logic input current (I
I
) ......................................................................................
±
10 mA
Output current (I
O
):
Device types 01, 03, 04, 06, 07, 09, 10 ......................................................... 190 mA
Device types 02, 05, 08, 11 .......................................................................... 1000 mA
Maximum junction temperature (T
J
) ................................................................. +150
°
C
Receiver common mode input voltage range (V
IC
):
Device types 01, 03, 04, 06, 07, 09, 10 ......................................................... -11 V dc to +11 V dc
Device types 02, 05, 08, 11 .......................................................................... -5 V dc to +5 V dc
Lead temperature (soldering, 5 seconds)........................................................... +300
°
C
Thermal resistance junction-to-case (
Θ
JC
): 3/
Cases X and Y ............................................................................................. 7
°
C/W
1/
2/
This package contains 96 terminals on the bottom and 4 terminals on top of the package, see figure 1.
Stress outside the listed absolute maximum rating may cause permanent damage to the device. This is a stress rating
only, and functional operation of the device at these or any other conditions beyond limits indicated in the operational
sections of this specification is not recommended. Exposure to absolute maximum rating conditions for extended periods
affect device reliability.
Per MIL-STD-883, Method 1012.
3/
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