參數(shù)資料
型號(hào): 5962-9163401MPX
廠商: INTERSIL CORP
元件分類: 運(yùn)算放大器
英文描述: OP-AMP, 750 uV OFFSET-MAX, 100 MHz BAND WIDTH, CDIP8
封裝: CERDIP-8
文件頁數(shù): 10/10頁
文件大?。?/td> 318K
代理商: 5962-9163401MPX
9
HA-5221
Ceramic Leadless Chip Carrier Packages (CLCC)
D
j x 45o
D3
B
h x 45o
A
A1
E
L
L3
e
B3
L1
D2
D1
e1
E2
E1
L2
PLANE 2
PLANE 1
E3
B2
0.010
E H
S
0.010
E F
S
-E-
0.007
E F
M
S HS
B1
-H-
-F-
J20.A MIL-STD-1835 CQCC1-N20 (C-2)
20 PAD CERAMIC LEADLESS CHIP CARRIER PACKAGE
SYMBOL
INCHES
MILLIMETERS
NOTES
MIN
MAX
MIN
MAX
A
0.060
0.100
1.52
2.54
6, 7
A1
0.050
0.088
1.27
2.23
-
B
----
-
B1
0.022
0.028
0.56
0.71
2, 4
B2
0.072 REF
1.83 REF
-
B3
0.006
0.022
0.15
0.56
-
D
0.342
0.358
8.69
9.09
-
D1
0.200 BSC
5.08 BSC
-
D2
0.100 BSC
2.54 BSC
-
D3
-
0.358
-
9.09
2
E
0.342
0.358
8.69
9.09
-
E1
0.200 BSC
5.08 BSC
-
E2
0.100 BSC
2.54 BSC
-
E3
-
0.358
-
9.09
2
e
0.050 BSC
1.27 BSC
-
e1
0.015
-
0.38
-
2
h
0.040 REF
1.02 REF
5
j
0.020 REF
0.51 REF
5
L
0.045
0.055
1.14
1.40
-
L1
0.045
0.055
1.14
1.40
-
L2
0.075
0.095
1.91
2.41
-
L3
0.003
0.015
0.08
0.38
-
ND
5
3
NE
5
3
N20
20
3
Rev. 0 5/18/94
NOTES:
1. Metallized castellations shall be connected to plane 1 terminals
and extend toward plane 2 across at least two layers of ceramic
or completely across all of the ceramic layers to make electrical
connection with the optional plane 2 terminals.
2. Unless otherwise specied, a minimum clearance of 0.015 inch
(0.38mm) shall be maintained between all metallized features
(e.g., lid, castellations, terminals, thermal pads, etc.)
3. Symbol “N” is the maximum number of terminals. Symbols “ND”
and “NE” are the number of terminals along the sides of length
“D” and “E”, respectively.
4. The required plane 1 terminals and optional plane 2 terminals (if
used) shall be electrically connected.
5. The corner shape (square, notch, radius, etc.) may vary at the
manufacturer’s option, from that shown on the drawing.
6. Chip carriers shall be constructed of a minimum of two ceramic
layers.
7. Dimension “A” controls the overall package thickness. The maxi-
mum “A” dimension is package height before being solder dipped.
8. Dimensioning and tolerancing per ANSI Y14.5M-1982.
9. Controlling dimension: INCH.
相關(guān)PDF資料
PDF描述
5962-9163401M2X OP-AMP, 750 uV OFFSET-MAX, 100 MHz BAND WIDTH, CQCC20
5962-9166501HXA OP-AMP, 2000 uV OFFSET-MAX, MBCY12
5962-9166501HXC OP-AMP, 2000 uV OFFSET-MAX, MBCY12
5962-9166501HXX OP-AMP, 2000 uV OFFSET-MAX, MBCY12
5962-9170001HXA OP-AMP, 3000 uV OFFSET-MAX, MBFM8
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