參數(shù)資料
型號(hào)： 593002B03400G
廠商： Aavid Thermalloy
文件頁數(shù)： 35/116頁
文件大?。?/td> 0K
描述： HEATSINK TWISTED FIN TO-220
產(chǎn)品培訓(xùn)模塊： How to Select a Heat Sink
產(chǎn)品目錄繪圖： 593002B03400G
標(biāo)準(zhǔn)包裝： 500
類型： 插件板級(jí)，垂直
冷卻式包裝： TO-220
固定方法： 螺栓固定和 PC 引腳
形狀： 矩形
長(zhǎng)度： 1.180"（29.97mm）
寬： 0.942"（23.93mm）
機(jī)座外的高度（散熱片高度）： 0.500"（12.70mm）
溫升時(shí)的功耗： 1W @ 20°C
在強(qiáng)制氣流下的熱敏電阻： 在 600 LFM 時(shí)為4°C/W
自然環(huán)境下的熱電阻： 13.4°C/W
材質(zhì)： 鋁
材料表面處理： 黑色陽極化處理
產(chǎn)品目錄頁面： 2672 (CN2011-ZH PDF)
相關(guān)產(chǎn)品： HS417-ND - MOUNTING KIT TO-220
其它名稱： HS336
25
THRU
HOLE
DISCRETE
SEMIC
O
NDUCT
O
R
P
A
C
K
A
GES
EUROPE
ASIA
Italy Tel: +39 051 764011 email: sales.it@aavid.com
United Kingdom Tel: +44 1793 401400 email: sales.uk@aavid.com
Singapore Tel: +65 6362 8388 email: sales@aavid.com.sg
Taiwan Tel: +886(2) 2698-9888 email: sales@aavid.com.tw
AMERICA
USA Tel: +1 (603) 224-9988 email: info@aavid.com
www.aavidthermalloy.com
7109
Surface mount heat sink for D
2 PAK (TO-263) package semiconductors
Surface mount heat sink for D
2 PAK
(TO-263) package semiconductors
remove the heat indirectly without
contacting the device like traditional
through hole heat sinks. The device
and the heat sink are soldered directly
to a modified drain pad creating a
thermal transfer path from package
tab to the heat sink.
25.40
(1.000)
19.38
(0.763)
15.24
(0.600)
11.43
(0.450)
11.43
(0.450)
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Th
ermal
Resistanc
eF
rom
MT
G
Sur
fac
et
oAmbien
t—°
C/W
at
t
5
0
20
40
60
80
100
01
2
3
4
5
4
3
1
2
0
400
200
600
800
1000
Moun
ting
Sur
fac
eT
emp
Ri
se
A
bo
ve
Ambien
t—°
C
1.3
(0.05)
12.70
(0.500)
10.16
(0.400)
7.37
(0.290)
30.99
(1.220)
17.53
(0.690)
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Th
ermal
Resistanc
eF
rom
MT
G
Sur
fac
et
oAmbien
t—°
C/W
at
t
20
0
10
20
30
40
50
0.0
0.5
1.0
1.5
2.0
2.5
16
12
4
8
0
400
200
600
800
1000
Ca
se
T
emp
R
ise
Ri
se
A
bo
ve
Ambien
t—°
C
Surface mount heat sink for D
3 PAK
(TO-268) package semiconductors
remove the heat indirectly without
contacting the device like traditional
through hole heat sinks. The device
and the heat sink are soldered directly
to a modified drain pad creating a
thermal transfer path from package
tab to the heat sink.
5734
Surface mount heat sink for D
3 PAK (TO-268) package semiconductors
Tape and Reel information
Part Number
“A” Dim
“B” Dim
“C” Dim
“D” Dim
7106D/TRG
44.00 (1.730)
40.40 (1.590)
24.00 (0.940)
4.06 (0.160)
7109D/TRG
44.00 (1.730)
40.40 (1.590)
36.00 (1.420)
4.06 (0.160)
573100D00010G
44.00 (1.730)
40.40 (1.590)
16.00 (0.630)
4.06 (0.160)
573300D00010G
44.00 (1.730)
40.40 (1.590)
24.00 (0.940)
4.06 (0.160)
573400D00010G
44.00 (1.730)
40.40 (1.590)
24.00 (0.940)
4.06 (0.160)
ORDERING INFORMATION
SMT
ORDERING INFORMATION
Part Number
Packaging
7109D/TRG
13" Reel, 125 per reel
7109DG
Bulk, 500 per bag
Material: 0.63 (0.025) Thick Copper
Finish: Tin Plated
See below for tape and reel information
Refer to Figure D on page 26 for board footprint information
ORDERING INFORMATION
Part Number
Packaging
573400D00010G
13" Reel, 250 per reel
573400D00000G
Bulk, 500 per bag
Material: 0.63 (0.025) Thick Copper
Finish: Tin Plated
See below for tape and reel information
Refer to Figure A and B on page 26 for board footprint information
A
B
C
D
相關(guān)PDF資料
PDF描述
172213-2 CONN PLUG HOUSING 2POS PNL MNT
573100D00000G TOP MOUNT HEATSINK .4" D-PAK
1-1437410-6 CONN TERM BLK CARD EDGE 36POS
1-1437410-4 CONN TERM BLOCK 0.2" 30 POS
1-1375820-3 CONN RCPT HSNG 13POS CST-100 II
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
593002B03400G MOD/.925 制造商:Aavid Thermalloy 功能描述:- Bulk
593002B13400G 制造商:Aavid Thermalloy 功能描述:TO-220 Package 13.40 C/W Thermal Resistance Solder Tab Channel Heat Sink
593002B30000 制造商:Aavid Thermalloy 功能描述:BOARD LEVEL STAMPED HEAT SINKS
593002B33400 制造商:Aavid Thermalloy 功能描述:BOARD LEVEL STAMPED HEAT SINKS
593-003 制造商:Digilent Inc 功能描述:INTRO TO DIGITAL DESIGN (VERILOG) - Bulk 制造商:DIGILENT, INC. 功能描述:INTRO TO DGTL DESIGN VERILOG
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