參數(shù)資料
型號： 580200W00000G
廠商： Aavid Thermalloy
文件頁數(shù)： 59/116頁
文件大?。?/td> 0K
描述： BOARD LEVEL HEAT SINK
產(chǎn)品培訓模塊： How to Select a Heat Sink
標準包裝： 2,000
類型： 頂部安裝
冷卻式包裝： 14-DIP 和 16-DIP
固定方法： 壓接式和 PC 引腳
形狀： 矩形
長度： 0.890"（22.61mm）
寬： 0.600"（15.24mm）
機座外的高度（散熱片高度）： 0.410"（10.42mm）
溫升時的功耗： 1W @ 20°C
在強制氣流下的熱敏電阻： 在 200 LFM 時為12.0°C/W
自然環(huán)境下的熱電阻： 20°C/W
材質(zhì)： 鋁
材料表面處理： 黑色陽極化處理
其它名稱： 002674
47
THRU
HOLE
DISCRETE
SEMIC
O
NDUCT
O
R
P
A
C
K
A
GES
EUROPE
ASIA
Italy Tel: +39 051 764011 email: sales.it@aavid.com
United Kingdom Tel: +44 1793 401400 email: sales.uk@aavid.com
Singapore Tel: +65 6362 8388 email: sales@aavid.com.sg
Taiwan Tel: +886(2) 2698-9888 email: sales@aavid.com.tw
AMERICA
USA Tel: +1 (603) 224-9988 email: info@aavid.com
www.aavidthermalloy.com
ORDERING INFORMATION
6225
Space saving staggered fin heat sink
for vertical mounting TO-220 devices.
Features solderable mounting tabs for
easy attachment to the PC board.
8.00
(0.315)
27.18
(1.070)
3.18
(0.125)
THRU
15.16
(0.597)
3.18
(0.125)
26.01
(1.024)
17.78
(0.700)
2.28
(0.090)
4.83
(0.190)
2.02
(0.080)
Part Number
Description
6225B-MTG
Space saving staggered fin heat sink
2.90 (0.114)
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal
Resistance
From
MTG
Surface
to
Ambient—
°
C/Watt
10
0
20
40
60
80
100
0
1
2
3
4
5
8
6
2
4
0
400
200
600
800
1000
Mounting
Surface
Temp
Rise
Above
Ambient—
°
C
12.70
(0.500)
35.05
(1.380)
25.40
(1.000)
50.80
(2.000)
2.46
(0.097)
25.40
(1.000)
18.28
(0.720)
4.75
(0.187)
3.18
(0.125)
2x
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal
Resistance
From
MTG
Surface
to
Ambient—
°
C/Watt
10
0
20
40
60
80
100
0
2
4
6
8
10
8
6
2
4
0
400
200
600
800
1000
Mounting
Surface
Temp
Rise
Above
Ambient—
°
C
Copper, space saving staggered
fin heat sink for vertical mounting
TO-220 devices. Features solderable
mounting tabs for easy attachment
to the PC board.
6032
Copper, space saving staggered fin heat sink
6022
Space saving staggered fin heat sink
Space saving staggered fin
heat sink for vertical mounting
TO-220 devices. Features staked
on solderable mounting tabs for
easy attachment to the PC board.
6.35
(0.250)
22.23
(0.875)
3.18
(0.125)
30.73
(1.210)
18.54
(0.730)
1.07
(0.042)
17.78
(0.700)
2.79
(0.110)
1.78
(0.070)
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal
Resistance
From
MTG
Surface
to
Ambient—
°
C/Watt
10
0
20
40
60
80
100
0
2
4
6
8
10
8
6
2
4
0
400
200
600
800
1000
Mounting
Surface
Temp
Rise
Above
Ambient—
°
C
Part Number
Finish
6022PBG
Pre-black anodize*
2.36 (0.093)
6022BG
Black anodize
2.36 (0.093)
ORDERING INFORMATION
Material: 1.02 (0.040) Thick Aluminum
Finish: Black Anodize
Material: 1.27 (0.050) Thick Copper
Finish: Tin Plated
Material: 1.02 (0.040) Thick Aluminum
Finish: See Table
ORDERING INFORMATION
Part Number
Description
6032DG
Copper space saving staggered fin heat sink
3.10 (0.122)
Dia of PCB
Plated Thru
Hole for Tabs
TO-220 Heat Sinks
Dia of PCB
Plated Thru
Hole for Tabs
Dia of PCB
Plated Thru
Hole for Tabs
*Edges cut during the manufacturing process will be unfinished.
See page 110 for more information
For additional options see page 85
Grease
Epoxy
&
page112
Mounting
Kits
page 99
Grease
Epoxy
&
page112
Mounting
Kits
page 99
Grease
Epoxy
&
page112
Mounting
Kits
page 99
相關(guān)PDF資料
PDF描述
580500B00000G HEATSINK 24-DIP BLK ANODIZED
590102B03600G HEATSINK TO-220 W/TABS 1.67"HIGH
5901G BOARD LEVEL HEAT SINK
591302B04000G BOARD LEVEL HEAT SINK
5915PC-22T-B30-SM0 FAN 220VAC 172X150X38MM POTTED
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