參數(shù)資料
型號： 579802B00000G
廠商： Aavid Thermalloy
文件頁數(shù)： 21/116頁
文件大?。?/td> 0K
描述： BOARD LEVEL HEAT SINK
產(chǎn)品培訓模塊： How to Select a Heat Sink
標準包裝： 1,000
類型： 插件板級
冷卻式包裝： TO-220
固定方法： 夾
形狀： 矩形
長度： 0.900"（22.86mm）
寬： 0.750"（19.05mm）
機座外的高度（散熱片高度）： 0.420"（10.67mm）
溫升時的功耗： 1W @ 30°C
在強制氣流下的熱敏電阻： 在 500 LFM 時為8°C/W
自然環(huán)境下的熱電阻： 26.4°C/W
材質： 鋁
材料表面處理： 黑色陽極化處理
其它名稱： 002652
12
HEA
T
SINKS
F
OR
IC
P
A
CK
A
GES
EUROPE
ASIA
Italy Tel: +39 051 764011 email: sales.it@aavid.com
United Kingdom Tel: +44 1793 401400 email: sales.uk@aavid.com
Singapore Tel: +65 6362 8388 email: sales@aavid.com.sg
Taiwan Tel: +886(2) 2698-9888 email: sales@aavid.com.tw
AMERICA
USA Tel: +1 (603) 224-9988 email: info@aavid.com
www.aavidthermalloy.com
ORDERING INFORMATION
Solder anchor attachment
Aavid's unique Solder anchor attachment method
uses two or four small Solder anchors attached to
the circuit card and a wire spring clip to securely
fasten the heat sink to the device. This method is
rugged, compact and allows for easy removal in
case of rework.
All products include a phase change pad suitable
for most IC package styles to optimize thermal
performance. Models are available with a single
or dual spring clips for additional thermal interface
pressure. Solder anchors are ordered separately.
IC Pkg Size (mm)
IC Pkg Style
Part Number
“W” (mm)
“L” (mm) “H” (mm)
“A” (mm)
θn
1
θf
2
Finish
Fig.
4
PCB Fig.
4
#Anchors
3
23 x 23
All
374024B60023G
23.00
10.00
49.70
40.00
11.69
Black anodize
1
A
2
23 x 23
All
374124B60023G
23.00
18.00
49.70
23.40
7.39
Black anodize
1
A
2
23 x 23
All
374224B60023G
23.00
25.00
49.70
19.70
6.37
Black anodize
1
A
2
27 x 27
All
374324B60023G
27.00
10.00
49.70
30.60
9.35
Black anodize
1
A
2
27 x 27
All
374424B60023G
27.00
18.00
49.70
20.30
6.46
Black anodize
1
A
2
27 x 27
All
374524B60023G
27.00
25.00
49.70
16.50
5.47
Black anodize
1
A
2
35 x 35
Flip chip
10-5634-01G
31.00
34.90
23.00
11.50
4.20
Black anodize
2
C
2
35 x 35
Flip chip
10-THMA-01G
31.00
34.90
35.00
10.70
3.95
Black anodize
2
C
2
35 x 35
All
374624B60024G
35.00
10.00
62.30
23.40
7.55
Black anodize
1
B
2
35 x 35
All
374724B60024G
35.00
18.00
62.30
15.30
5.15
Black anodize
1
B
2
35 x 35
All
374824B60024G
35.00
25.00
62.30
12.00
4.27
Black anodize
1
B
2
37.5 x 37.5
Flip chip
10-BRD2-01G
35.70
37.30
23.00
11.50
4.20
Clear anodize
2
B
2
37.5 x 37.5
Flip chip
10-BRD1-01G
37.50
23.00
10.10
3.83
Black anodize
2
B
2
37.5 x 37.5
Flip chip
10-BRD1-03G
37.50
23.00
10.10
3.83
Black anodize
3
D
4
37.5 x 37.5
Flip chip
10-BRD1-04G
37.50
23.00
10.10
3.83
Black anodize
2
B
2
37.5 x 37.5
Flip chip
10-BRD1-05G
37.50
23.00
10.10
3.83
Clear anodize
3
D
4
37.5 x 37.5
Flip chip
10-BRD1-07G
37.50
23.00
10.10
3.83
Clear anodize
2
B
2
40 x 40
All
374924B60024G
40.00
10.00
62.30
20.30
6.46
Black anodize
1
B
2
40 x 40
All
375024B60024G
40.00
18.00
62.30
12.20
4.34
Black anodize
1
B
2
42 x 40
All
375124B60024G
40.00
25.00
62.30
10.30
3.83
Black anodize
1
B
2
42.5 x 42.5
Flip chip
10-CLS1-01G
42.30
23.00
8.80
3.51
Black anodize
2
E
2
42.5 x 42.5
Flip chip
10-CLS2-01G
42.30
35.00
8.30
3.44
Black anodize
2
E
2
BGA–Solder Anchor
1. Natural convection thermal resistance based on a 75 C heat sink temperature rise.
2. Force convection thermal resistance based on an entering 1.0 m/s (200LFM) airflow.
3. Solder anchors are sold separately refer to drawing above.
4. Solder anchor mechanical drawings and board mounting drawings see page 13.
7.19
(0.283)
7.62
(0.300)
5.08
(0.200)
0.64
(0.025)
"A"
2.49
(0.098)
SOLDER ANCHOR
Part Number
PCB Thickness (mm)
“A” Dim (mm)
125700D00000G
1.60
3.61
125800D00000G
2.54-2.79
4.70
相關PDF資料
PDF描述
580200W00000G BOARD LEVEL HEAT SINK
580500B00000G HEATSINK 24-DIP BLK ANODIZED
590102B03600G HEATSINK TO-220 W/TABS 1.67"HIGH
5901G BOARD LEVEL HEAT SINK
591302B04000G BOARD LEVEL HEAT SINK
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