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參數(shù)資料
| 型號(hào)： | 579-10-484-11-000429 |
| 廠商： | MILL-MAX MFG CORP |
| 元件分類： | 插座 |
| 英文描述： | BGA484, IC SOCKET |
| 封裝： | ROHS COMPLIANT |
| 文件頁(yè)數(shù)： | 1/2頁(yè) |
| 文件大小： | 728K |
| 代理商： | 579-10-484-11-000429 |
BGA adapter/socket systems are a reliable way to make BGAs
pluggable, they may also be used as a
high density board-to-board interconnect.
The BGA device is soldered to a 9929
adapter (or a 7929 adapter is soldered
to a PCB); and then either one can be
plugged into a 9645 surface mount socket.
Both socket and adapter have the same
footprint as the BGA device.
Insertion force is only .4N per pin, and a pry-bar tool
(part #828-01-010) is available for extraction.
Insulator material is FR-4 epoxy having a TCE to match the BGA
device and circuit board.
BALL GRID ARRAYS
For 0.8mm Grid
Male Pin Adapters & Female Socket
www.mill-max.com
516-922-6000
111.1
Series 5XX
FOR PCB MOUNT ADAPTERS
Locate footprint pattern from page 111.2, the middle 8 digits of the part
number will be located under the pattern.
FOR BGA MOUNT ADAPTERS
Locate footprint pattern from page 111.2, the middle 8 digits of the part
number will be located under the pattern.
FOR FEMALE SOCKETS
Locate footprint pattern from page 111.2, the middle 8 digits of the part
number will be located under the pattern.
9
.047
.010 DIA.
.024 DIA.
.054
.123
.013
.090
.062
.016 DIA.
.027 DIA.
Ordering Information
Series
Plating
Window
9
1 0
4
9
Code
-
--
No. of pins
Grid size
Pattern #
Determined from footprint pattern on page 111.2
2
SPECIFY PLATING CODE XX=
Sleeve (Pin)
Contact (Clip)
11
10
μ”Au
10
μ”Au
Series
Plating
Window
1 1
4
2
Code
-
--
-
No. of pins
Grid size
Pattern #
Determined from footprint pattern on page 111.2
4
PLATING CODE XX=
Pin Plating
10
10
μ”Au
BGA MOUNT
ADAPTER PIN TYPE 9929
PRINTED CIRCUIT MOUNT
ADAPTER PIN TYPE 7929
SURFACE MOUNT
RECEPTACLE TYPE 9942
5
9
7
1 0
4
9
-
--
No. of pins
Grid size
Pattern #
Determined from footprint pattern on page 111.2
2
5
.018
.054
.141
.010 DIA.
.024 DIA.
.047
Series
Plating
Window
Code
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