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    參數(shù)資料
    型號(hào): 574902B03300G
    廠商: Aavid Thermalloy
    文件頁數(shù): 103/116頁
    文件大小: 0K
    描述: HEATSINK TO-220 VERT MNT W/TAB
    產(chǎn)品培訓(xùn)模塊: How to Select a Heat Sink
    標(biāo)準(zhǔn)包裝: 500
    類型: 插件板級(jí),垂直
    冷卻式包裝: TO-220
    固定方法: 夾和 PC 引腳
    形狀: 矩形
    長度: 1.375"(34.93mm)
    寬: 0.860"(21.84mm)
    機(jī)座外的高度(散熱片高度): 0.395"(10.03mm)
    溫升時(shí)的功耗: 2.5W @ 40°C
    在強(qiáng)制氣流下的熱敏電阻: 在 400 LFM 時(shí)為6.0°C/W
    自然環(huán)境下的熱電阻: 16°C/W
    材質(zhì):
    材料表面處理: 黑色陽極化處理
    產(chǎn)品目錄頁面: 2671 (CN2011-ZH PDF)
    其它名稱: HS360
    87
    INTERF
    A
    CE
    MA
    TERIALS
    EUROPE
    ASIA
    Italy Tel: +39 051 764011 email: sales.it@aavid.com
    United Kingdom Tel: +44 1793 401400 email: sales.uk@aavid.com
    Singapore Tel: +65 6362 8388 email: sales@aavid.com.sg
    Taiwan Tel: +886 (2) 2698-9888 email: sales@aavid.com.tw
    AMERICA
    USA Tel: +1 (603) 224-9988 email: info@aavid.com
    www.aavidthermalloy.com
    Alignment Pads
    Aavid Thermalloy has added a phase change
    pad to its line-up. These pads provide low
    thermal resistance and electrical isolation
    for low pressure spring mount applications.
    Above the phase change temperature the
    material flows to fill in surface irregularities
    and maximize the heat conduction path.
    Interface Material/Pads
    Solderable alignment pads are an innovative
    way to attach the heat sink to your transistor that
    could cut your assembly time by more than half.
    Alignment pads provide cost effective solderability,
    while providing numerous additional benefits.
    Alignment pads are factory applied and can be
    bought separately as well. Please refer to accessory
    Index D on page 85.
    Suffix
    Device
    Figure
    8223-CL03G
    TO-220
    B
    8241-CL11G
    TO-218
    A
    Hi-Flow *
    (1.000)
    25.40
    (0.030)
    0.76
    (0.122)
    3.10
    (0.985)
    25.02
    (0.520)
    13.21
    (1.200)
    30.48
    (0.860)
    21.84
    9.40
    (0.370)
    5.08
    (0.200)
    3.25
    (0.128)
    1
    CLIP ASSEMBLY
    CL
    (0.460)
    11.68
    (0.300)
    7.62
    (0.670)
    17.02
    0.51
    (0.020)
    TYP THK
    14.22
    (0.560)
    3.18
    (0.125)
    0.76
    (0.030)
    (0.860)
    21.84
    5.08
    (0.200)
    (0.790)
    20.07
    Figure A
    ORDERING INFORMATION
    example
    Thermalloy origin part 7022B–8223–CL03 G
    A
    B
    A = Model number
    B = Alignment pad
    C = RoHS compliant
    Figure B
    Typical installation
    Shown with part number 8241-CL11
    Recommended hole pattern for 8223-CL03G
    Recommended hole pattern for 8241-CL11G
    14.73
    (0.580)
    7.37
    (0.290)
    2.54
    (0.100)
    2.54
    (0.100)
    PLATED THRU HOLE PER
    DEVICE MANUFACTURERS
    RECOMMENDATION
    2.95
    (0.116)
    DIA PLATED
    THRU HOLE
    25.40
    (1.000)
    12.70
    (0.500)
    5.46
    (0.215)
    2.95
    (0.116)
    DIA PLATED
    THRU HOLE
    5.46
    (0.215)
    1.60
    (0.063)
    DIA PLATED
    THRU HOLE
    TYP(3)
    TYP(2)
    C
    Reinforcement carrier
    Polymide
    Thickness
    0.127 (0.005)
    Continuous use temp (°C)
    150
    Phase change temp(°C)
    55
    Dielectric breakdown voltage (Vac)
    5000
    Dielectric constant (1000 Hz)
    4.5
    Volume resistivity (Ohm-meter)
    1012
    MATERIAL PROPERTIES
    (1.650)
    41.91
    (1.140)
    28.96
    2X
    (0.093)
    2.36
    2X
    (0.140)
    3.56
    21.84
    (0.860)
    18.80
    (0.740)
    2.69
    (0.160)
    16.76
    (0.660)
    DIA
    19.05
    (0.750)
    12.70
    (0.500)
    3.73
    (0.147)
    14.30
    (0.563)
    DIA
    TO-3
    TO-220
    TO-218
    530101B _ 5150G
    Ordering code
    ORDERING INFORMATION
    example 12 digit part
    Ordering code
    Description
    0
    No pads
    7
    One Hi-Flow pad
    8
    Two Hi-Flow pads
    The shape and hole pattern of the heat sink will determine the shape and hole
    pattern of the pad. If you are ordering a heat sink which mounts to a semicon-
    ductor on both sides, the ordering code for two pads should be used. To order
    additional Hi-Flow pads separate, or factory applied variations please contact
    an Aavid sales rep for inquiries.
    Thermal impedance vs. pressure
    Pressure
    10
    25
    50
    200
    TO-220 Thermal performance (C/W)
    1.15
    1.14
    1.12
    1.1
    * Hi-Flow is a registered trademark of the Bergquist Company
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