參數(shù)資料
型號： 574802B00000G
廠商： Aavid Thermalloy
文件頁數(shù)： 106/116頁
文件大?。?/td> 0K
描述： BOARD LEVEL HEAT SINK
產(chǎn)品培訓(xùn)模塊： How to Select a Heat Sink
標(biāo)準(zhǔn)包裝： 1,000
類型： 插件板級
冷卻式包裝： TO-220
固定方法： 夾
形狀： 矩形
長度： 0.900"（22.86mm）
寬： 1.020"（25.91mm）
機(jī)座外的高度（散熱片高度）： 0.420"（10.67mm）
溫升時(shí)的功耗： 3W @ 60°C
在強(qiáng)制氣流下的熱敏電阻： 在 500 LFM 時(shí)為6°C/W
自然環(huán)境下的熱電阻： 20.4°C/W
材質(zhì)： 鋁
材料表面處理： 黑色陽極化處理
其它名稱： 002273
9
HO
W
T
O
S
ELECT
A
HEA
T
SINK
EUROPE
ASIA
Italy Tel: +39 051 764011 email: sales.it@aavid.com
United Kingdom Tel: +44 1793 401400 email: sales.uk@aavid.com
Singapore Tel: +65 6362 8388 email: sales@aavid.com.sg
Taiwan Tel: +886(2) 2698-9888 email: sales@aavid.com.tw
AMERICA
USA Tel: +1 (603) 224-9988 email: info@aavid.com
www.aavidthermalloy.com
The basic equation for heat transfer or power dissipation may be stated as follows:
Where:
PD = the power dissipated by the semiconductor device in watts.
ΔT = the temperature difference of driving potential which causes the flow of heat.
ΣRθ = the sum of the thermal resistances of the heat flow path across which ΔT exists.
The above relationship may be stated in the following forms:
The above equations are generally used to determine the required thermal resistance of the heat sink (RθSA),
since the heat dissipation, maximum junction and/or case temperature, and ambient temperature are known or set.
How To Select a Heat Sink
Where:
TJ = the junction temperature in °C (maximum is usually stated by the manufacturer of the semiconductor device).
TC = case temperature of the semiconductor device in °C.
TS = temperature of the heat sink mounting surface in thermal contact with the semiconductor device in °C.
TA = ambient air temperature in °C.
RθJC = thermal resistance from junction to case of the semiconductor device in °C per watt
(usually stated by manufacturer of semiconductor device).
RθCS = thermal resistance through the interface between the semiconductor device
and the surface on which it is mounted in °C per watt.
RθSA = thermal resistance from mounting surface to ambient or thermal resistance of heat sink in °C per watt.
Figure 1 indicates the location of the various heat
flow paths, temperatures and thermal resistances.
The common practice is to represent the system with
a network of resistances in series as shown in Figure 2.
Atmosphere
or ambient
Mounting surface
(cooler/dissipator)
Semiconductor case
Junction
(heat source)
Interface
Heat flow path mounting
surface to ambient, equation (3)
Heat flow path case
to ambient equation (2)
Heat flow path junction
to ambient, equation (1)
P
D
P
D
T
A
R
θSA
R
θCS
R
θJC
T
S
T
C
T
A
T
J
TJ–TA
PD =
RθJC + RθCS + RθSA
TC–TA
PD =
RθCS + RθSA
TS–TA
PD =
RθSA
Δ T
PD =
ΣRθ
RθCS
RθJC
TS
TA
TJ
RθSA
TC
FIGURE 1
FIGURE 2
How to select a heat sink
相關(guān)PDF資料
PDF描述
5176375-8 CONN RCPT FH 180POS 050 VERT
767114-3 CONN RCPT 114POS .025 VERT SMD
7140DG BOARD LEVEL HEAT SINK
SOMC160351R0GEA RES ARRAY 51 OHM 8 RES 16-SOIC
1-767096-0 CONN RCPT 114POS .025 VERT SMD
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
574802B03300 功能描述:散熱片 TO-220 VERT 20.4 TR SLIDE ON SOLDER TABS RoHS:否 制造商:Ampro By ADLINK 產(chǎn)品:Heat Sink Accessories 安裝風(fēng)格:Through Hole 散熱片材料: 散熱片樣式: 熱阻: 長度: 寬度: 高度: 設(shè)計(jì)目的:Express-HRR
574802B03300G 功能描述:散熱片 TO-220 VERT 20.4 TR RoHS:否 制造商:Ampro By ADLINK 產(chǎn)品:Heat Sink Accessories 安裝風(fēng)格:Through Hole 散熱片材料: 散熱片樣式: 熱阻: 長度: 寬度: 高度: 設(shè)計(jì)目的:Express-HRR
574802B03700 制造商:Aavid Thermalloy 功能描述:- Bulk
574802B03700G 功能描述:散熱片 TO-220 VERT W/STEP RoHS:否 制造商:Ampro By ADLINK 產(chǎn)品:Heat Sink Accessories 安裝風(fēng)格:Through Hole 散熱片材料: 散熱片樣式: 熱阻: 長度: 寬度: 高度: 設(shè)計(jì)目的:Express-HRR
5748078-1 功能描述:D-Sub工具與硬件 DSUB ACC: SLIDE LATCH RoHS:否 制造商:3M Electronic Solutions Division 產(chǎn)品:Accessories 類型:Strain Relief, 36 Position 用于:Wiremount D-Sub Connectors
發(fā)布緊急采購，3分鐘左右您將得到回復(fù)。

采購需求

(若只采購一條型號，填寫一行即可)

發(fā)布成功！您可以繼續(xù)發(fā)布采購。也可以進(jìn)入我的后臺，查看報(bào)價(jià)

發(fā)布成功！您可以繼續(xù)發(fā)布采購。也可以進(jìn)入我的后臺，查看報(bào)價(jià)

*型號 *數(shù)量 廠商 批號 封裝
添加更多采購

我的聯(lián)系方式

*
*
*