參數(shù)資料
型號(hào)： 574102B00000G
廠商： Aavid Thermalloy
文件頁數(shù)： 106/116頁
文件大?。?/td> 0K
描述： HEATSINK TO-220 CLIP-ON BLK
產(chǎn)品培訓(xùn)模塊： How to Select a Heat Sink
產(chǎn)品目錄繪圖： 574(1,5)02B00000G
標(biāo)準(zhǔn)包裝： 1,000
類型： 插件板級(jí)
冷卻式包裝： TO-220
固定方法： 夾
形狀： 矩形
長(zhǎng)度： 0.750"（19.05mm）
寬： 0.860"（21.84mm）
機(jī)座外的高度（散熱片高度）： 0.395"（10.03mm）
溫升時(shí)的功耗： 1.5W @ 40°C
在強(qiáng)制氣流下的熱敏電阻： 在 500 LFM 時(shí)為8°C/W
自然環(huán)境下的熱電阻： 23.2°C/W
材質(zhì)： 鋁
材料表面處理： 黑色陽極化處理
產(chǎn)品目錄頁面： 2671 (CN2011-ZH PDF)
其它名稱： 574102B00000
5741B
HS111
9
HO
W
T
O
S
ELECT
A
HEA
T
SINK
EUROPE
ASIA
Italy Tel: +39 051 764011 email: sales.it@aavid.com
United Kingdom Tel: +44 1793 401400 email: sales.uk@aavid.com
Singapore Tel: +65 6362 8388 email: sales@aavid.com.sg
Taiwan Tel: +886(2) 2698-9888 email: sales@aavid.com.tw
AMERICA
USA Tel: +1 (603) 224-9988 email: info@aavid.com
www.aavidthermalloy.com
The basic equation for heat transfer or power dissipation may be stated as follows:
Where:
PD = the power dissipated by the semiconductor device in watts.
ΔT = the temperature difference of driving potential which causes the flow of heat.
ΣRθ = the sum of the thermal resistances of the heat flow path across which ΔT exists.
The above relationship may be stated in the following forms:
The above equations are generally used to determine the required thermal resistance of the heat sink (RθSA),
since the heat dissipation, maximum junction and/or case temperature, and ambient temperature are known or set.
How To Select a Heat Sink
Where:
TJ = the junction temperature in °C (maximum is usually stated by the manufacturer of the semiconductor device).
TC = case temperature of the semiconductor device in °C.
TS = temperature of the heat sink mounting surface in thermal contact with the semiconductor device in °C.
TA = ambient air temperature in °C.
RθJC = thermal resistance from junction to case of the semiconductor device in °C per watt
(usually stated by manufacturer of semiconductor device).
RθCS = thermal resistance through the interface between the semiconductor device
and the surface on which it is mounted in °C per watt.
RθSA = thermal resistance from mounting surface to ambient or thermal resistance of heat sink in °C per watt.
Figure 1 indicates the location of the various heat
flow paths, temperatures and thermal resistances.
The common practice is to represent the system with
a network of resistances in series as shown in Figure 2.
Atmosphere
or ambient
Mounting surface
(cooler/dissipator)
Semiconductor case
Junction
(heat source)
Interface
Heat flow path mounting
surface to ambient, equation (3)
Heat flow path case
to ambient equation (2)
Heat flow path junction
to ambient, equation (1)
P
D
P
D
T
A
R
θSA
R
θCS
R
θJC
T
S
T
C
T
A
T
J
TJ–TA
PD =
RθJC + RθCS + RθSA
TC–TA
PD =
RθCS + RθSA
TS–TA
PD =
RθSA
Δ T
PD =
ΣRθ
RθCS
RθJC
TS
TA
TJ
RθSA
TC
FIGURE 1
FIGURE 2
How to select a heat sink
相關(guān)PDF資料
PDF描述
KUP-11AA5-24 RELAY GEN PURPOSE DPDT 10A 24V
KUP-11AA5-120 RELAY GEN PURPOSE DPDT 10A 120V
0366640001 MLX FEMALE TERMINAL 10-12 AWG
WM071I,AL WALLMNT ENCLOSURE 6.88X4.88X1.10
KUP-11AE5-120 RELAY GEN PURPOSE DPDT 10A 120V
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
574102B03200 制造商:Aavid Thermalloy 功能描述:BOARD LEVEL STAMPED HEAT SINKS
574102B03300 制造商:Aavid Thermalloy 功能描述:- Bulk 制造商:Aavid Thermalloy 功能描述:Heat Sink Passive TO-220 Thru-Hole 23.2°C/W Black Anodized
574102B03300G 功能描述:散熱片 BLK HEAT SINK TO-220 RoHS:否 制造商:Ampro By ADLINK 產(chǎn)品:Heat Sink Accessories 安裝風(fēng)格:Through Hole 散熱片材料: 散熱片樣式: 熱阻: 長(zhǎng)度: 寬度: 高度: 設(shè)計(jì)目的:Express-HRR
574102B03700 制造商:Aavid Thermalloy 功能描述:- Bulk
574102B03700G 功能描述:散熱片 SLIDE ON TO-220 19.05mm VERT BLK RoHS:否 制造商:Ampro By ADLINK 產(chǎn)品:Heat Sink Accessories 安裝風(fēng)格:Through Hole 散熱片材料: 散熱片樣式: 熱阻: 長(zhǎng)度: 寬度: 高度: 設(shè)計(jì)目的:Express-HRR
發(fā)布緊急采購(gòu)，3分鐘左右您將得到回復(fù)。

采購(gòu)需求

(若只采購(gòu)一條型號(hào)，填寫一行即可)

發(fā)布成功！您可以繼續(xù)發(fā)布采購(gòu)。也可以進(jìn)入我的后臺(tái)，查看報(bào)價(jià)

發(fā)布成功！您可以繼續(xù)發(fā)布采購(gòu)。也可以進(jìn)入我的后臺(tái)，查看報(bào)價(jià)

*型號(hào) *數(shù)量 廠商 批號(hào) 封裝
添加更多采購(gòu)

我的聯(lián)系方式

*
*
*