參數(shù)資料
型號(hào): 573300D00000G
廠商: Aavid Thermalloy
文件頁數(shù): 92/116頁
文件大?。?/td> 0K
描述: TOP MOUNT HEATSINK .4" D2PAK
產(chǎn)品培訓(xùn)模塊: How to Select a Heat Sink
產(chǎn)品目錄繪圖: 573300D000(0,1)0G
特色產(chǎn)品: Surface Mount Heat Sinks
標(biāo)準(zhǔn)包裝: 500
類型: 頂部安裝
冷卻式包裝: TO-263(D²Pak)
固定方法: SMD 基座
形狀: 矩形
長度: 0.500"(12.70mm)
寬: 1.030"(26.16mm)
機(jī)座外的高度(散熱片高度): 0.400"(10.16mm)
溫升時(shí)的功耗: 1.25W @ 30°C
在強(qiáng)制氣流下的熱敏電阻: 在 300 LFM 時(shí)為8°C/W
自然環(huán)境下的熱電阻: 18°C/W
材質(zhì):
材料表面處理:
產(chǎn)品目錄頁面: 2672 (CN2011-ZH PDF)
其它名稱: 041643
573300D00000G-ND
HS408
77
THRU
HOLE
DISCRETE
SEMIC
O
NDUCT
O
R
P
A
C
K
A
GES
EUROPE
ASIA
Italy Tel: +39 051 764011 email: sales.it@aavid.com
United Kingdom Tel: +44 1793 401400 email: sales.uk@aavid.com
Singapore Tel: +65 6362 8388 email: sales@aavid.com.sg
Taiwan Tel: +886(2) 2698-9888 email: sales@aavid.com.tw
AMERICA
USA Tel: +1 (603) 224-9988 email: info@aavid.com
www.aavidthermalloy.com
Axial Lead Devices
ORDERING INFORMATION
6000
Copper heat sink for axial lead devices
Copper heat sink for axial
lead device requires no extra
board space to mount. One lead
of the heat sink is soldered to
the device while the other sol-
ders to the PC board. Available
in two finishes.
C SYM
L
14.20
(0.559)
25.40
(1.000)
15.24
(0.600)
(0.250)
6.35
@ BASE
(1.200)
30.48
REF
25.40
(1.000)
27.30
(1.075)
1.90
(0.075)
1.27
(0.050)
15.24
(0.600)
20.32
(0.800)
DIA as required
for lead size
2.36
(0.093)
FIGURE A
Part Number
Description
Finish
6000UG
Heat sink for axial lead device
Unfinished
See figure A
6000DG
Heat sink for axial lead device
Tin plated*
See figure A
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal
Resistance
From
MTG
Surface
to
Ambient—
°
C/Watt
10
0
20
40
60
80
100
02
4
6
8
10
8
6
2
4
0
400
200
600
800
1000
Mounting
Surface
Temp
Rise
Above
Ambient—
°
C
ORDERING INFORMATION
(1.060)
26.92
(1.250)
31.75
"A"
(0.600)
15.24
SQ
Part Number
“A” Dim
6222BG
3.61 (0.142) Dia Thru
6223BG
4.14 (0.163) Dia Thru
6224BG
4.77 (0.188) Dia Thru
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal
Resistance
From
MTG
Surface
to
Ambient—
°
C/Watt
10
0
20
40
60
80
100
02
4
6
8
10
8
6
2
4
0
400
200
600
800
1000
Mounting
Surface
Temp
Rise
Above
Ambient—
°
C
Square basket style heat sink
for bridge rectifiers uses no
additional board space. Available
with three different mounting
hole diameters.
6222, 6223, 6224 Square basket style heat sink for bridge rectifiers
Material: 0.53 (0.021) Thick Copper
Finish: See Table
Bridge Rectifiers
Material: 1.27 (0.050) Thick Aluminum
Finish: Black Anodize
Dia of PCB
Plated Thru
Hole for Tabs
* See page 110 for more information
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