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  • 參數(shù)資料
    型號: 566902B00000G
    廠商: Aavid Thermalloy
    文件頁數(shù): 46/116頁
    文件大?。?/td> 0K
    描述: BOARD LEVEL HEAT SINK
    產(chǎn)品培訓模塊: How to Select a Heat Sink
    標準包裝: 500
    類型: 插件板級
    冷卻式包裝: TO-220,TO-262
    固定方法:
    形狀: 矩形
    長度: 0.850"(21.59mm)
    寬: 1.000"(25.40mm)
    機座外的高度(散熱片高度): 0.500"(12.70mm)
    溫升時的功耗: 2W @ 40°C
    在強制氣流下的熱敏電阻: 在 200 LFM 時為9.0°C/W
    自然環(huán)境下的熱電阻: 18.8°C/W
    材質(zhì):
    材料表面處理: 黑色陽極化處理
    其它名稱: 002115
    35
    THRU
    HOLE
    DISCRETE
    SEMIC
    O
    NDUCT
    O
    R
    P
    A
    C
    K
    A
    GES
    EUROPE
    ASIA
    Italy Tel: +39 051 764011 email: sales.it@aavid.com
    United Kingdom Tel: +44 1793 401400 email: sales.uk@aavid.com
    Singapore Tel: +65 6362 8388 email: sales@aavid.com.sg
    Taiwan Tel: +886(2) 2698-9888 email: sales@aavid.com.tw
    AMERICA
    USA Tel: +1 (603) 224-9988 email: info@aavid.com
    www.aavidthermalloy.com
    ORDERING INFORMATION
    6109, 6110
    Low cost channel style heat sink featuring integrated alignment tabs
    Low cost channel style heat sink features
    integrated alignment tabs to prevent the
    device from rotating while applying torque
    to the mounting hardware. Available in two
    lengths with a pre-black anodized finish.
    10.92
    (0.430)
    11.68
    (0.460)
    8.89
    (0.350)
    29.97
    (1.180)
    12.70
    (0.500)
    AT BASE
    25.40
    (1.000)
    3.81
    (0.150)
    Part Number
    Description
    Figure
    6109PBG
    Low cost channel heat sink with device locating tabs
    A
    6110PBG
    Low cost channel heat sink with device locating tabs
    B
    Air Velocity—Feet Per Minute
    Heat Dissipated—Watts
    Thermal
    Resistanc
    eF
    rom
    MT
    G
    Sur
    fac
    et
    oAmbien
    t—°C/W
    at
    t
    20
    0
    20
    40
    60
    80
    100
    0
    1
    2
    3
    4
    5
    16
    12
    4
    8
    0
    400
    200
    600
    800
    1000
    Moun
    ting
    Sur
    fac
    eT
    emp
    Ri
    se
    A
    bo
    ve
    Ambien
    t—°C
    6110
    6109
    ORDERING INFORMATION
    19.05
    (0.750) 13.34
    (0.525)
    6.35
    (0.250)
    3.81
    (0.150)
    6.60
    (0.260)
    3.81
    (0.150)
    3.81
    (0.150)
    1.27
    (0.050)
    9.52
    (0.375)
    CL
    13.21
    (0.520)
    AT BASE
    Part Number
    Description
    7178DG
    Narrow channel copper heat sink
    2.54 (0.100)
    Air Velocity—Feet Per Minute
    Heat Dissipated—Watts
    Thermal
    Resistance
    From
    MTG
    Surface
    to
    Ambient—
    °
    C/Watt
    10
    0
    20
    40
    60
    80
    100
    0.0
    0.4
    0.8
    1.2
    1.6
    2.0
    8
    6
    2
    4
    0
    400
    200
    600
    800
    1000
    Mounting
    Surface
    Temp
    Rise
    Above
    Ambient—
    °
    C
    Copper narrow channel style heat sink
    includes a single integrated tab to allow
    easy attachment to the PC board. Tin plated
    finish ensures easy solderability.
    7178
    Copper narrow channel style heat sink with a single integrated tab
    7136, 7139
    Copper channel style slide on heat sink featuring integrated mounting clip
    Copper channel style slide on heat
    sink features integrated mounting
    clip for easy no hardware attach-
    ment to the device. Also includes
    solderable mounting tabs for easy
    attachment to the PC board.
    21.54
    (0.848)
    1.27
    (0.050)
    13.08
    (0.515)
    13.21
    (0.520)
    2.79
    (0.110)
    4.19
    (0.165)
    2x
    1.27
    (0.050)
    2x
    17.78
    (0.700)
    Air Velocity—Feet Per Minute
    Heat Dissipated—Watts
    Thermal
    Resistanc
    eF
    rom
    MT
    G
    Sur
    fac
    et
    oAmbien
    t—°C/W
    at
    t
    20
    0
    20
    40
    60
    80
    100
    0
    1
    2
    3
    4
    5
    16
    12
    4
    8
    0
    400
    200
    600
    800
    1000
    Moun
    ting
    Sur
    fac
    eT
    emp
    Ri
    se
    A
    bo
    ve
    Ambien
    t—°C
    7139
    7136
    Part Number
    Description
    Figure
    7136DG
    Vertical mount
    A
    2.54 (0.100)
    7139DG
    Horizontal mount
    B
    2.54 (0.100)
    ORDERING INFORMATION
    19.81
    (0.780)
    14.86
    (0.580)
    13.08
    (0.515)
    2.79
    (0.110)
    13.21
    (0.520)
    2.03
    (0.080)
    Top is cut away
    to show detail
    16.51
    (0.650)
    Material: 1.27 (0.050) Thick Aluminum
    Finish: Pre-Black Anodize*
    Material: 0.63 (0.025) Thick Copper
    Finish: Tin Plated
    Material: 0.63 (0.025) Thick Copper
    Finish: Tin Plated
    Dia of PCB
    Plated Thru
    Hole for Tabs
    TO-220 Heat Sinks
    Position
    Code
    Description
    Details
    A
    MT
    Solderable mounting tabs
    Page 93
    Dia of PCB
    Plated Thru
    Hole for Tabs
    * Edges cut during the manufacturing process will be unfinished.
    See page 110 for more information
    10.92
    (0.430)
    AT BASE
    25.40
    (1.000)
    5.72
    (0.225)
    8.89
    (0.350)
    3.81
    (0.150)
    18.03
    (0.710)
    12.70
    (0.500)
    CL
    POPULAR OPTIONS:
    Base part no.
    A
    61_ _PB -
    G
    For additional options see page 85
    FIGURE A
    FIGURE B
    FIGURE A
    FIGURE B
    Grease
    Epoxy
    &
    page112
    Mounting
    Kits
    page 99
    Grease
    Epoxy
    &
    page112
    Mounting
    Kits
    page 99
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    相關(guān)代理商/技術(shù)參數(shù)
    參數(shù)描述
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    566902B03100G 功能描述:BOARD LEVEL HEAT SINK RoHS:是 類別:風扇,熱管理 >> 熱敏 - 散熱器 系列:- 產(chǎn)品目錄繪圖:BDN12-3CB^A01 標準包裝:300 系列:BDN 類型:頂部安裝 冷卻式包裝:分類(BGA,LGA,CPU,ASIC……) 固定方法:散熱帶,粘合劑(含) 形狀:方形,鰭片 長度:1.21"(30.73mm) 寬:1.210"(30.73mm) 直徑:- 機座外的高度(散熱片高度):0.355"(9.02mm) 溫升時的功耗:- 在強制氣流下的熱敏電阻:在 400 LFM 時為6.8°C/W 自然環(huán)境下的熱電阻:19.6°C/W 材質(zhì):鋁 材料表面處理:黑色陽極化處理 產(chǎn)品目錄頁面:2681 (CN2011-ZH PDF) 其它名稱:294-1099
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