- 您現(xiàn)在的位置：買賣IC網(wǎng) > PDF目錄20851 > 5519S 210 MM X 155 MM X 1.5 MM (3M)THERM PAD 5519S 210X155MM 1.5MM PDF資料下載
參數(shù)資料
| 型號： | 5519S 210 MM X 155 MM X 1.5 MM |
| 廠商： | 3M |
| 文件頁數(shù)： | 2/3頁 |
| 文件大?。?/td> | 0K |
| 描述： | THERM PAD 5519S 210X155MM 1.5MM |
| 標準包裝： | 25 |
| 系列： | 5519S |
| 使用： | 片狀 |
| 形狀： | 矩形 |
| 外形： | 210.00mm x 155.00mm |
| 厚度： | 0.059"（1.50mm） |
| 材質(zhì)： | 硅質(zhì) |
| 膠合劑： | 膠粘 - 一側(cè) |
| 背襯，載體： | 聚萘二甲酸乙二醇酯（PEN） |
| 顏色： | 白 |
| 導熱性： | 4.1 W/m-K |
| 其它名稱： | 3M9595 WX300909685 |
Typical Physical Properties
Note: The following technical information and data should be considered representative or typical only and should not be used
for specification purposes.
3M Thermally Conductive Silicone Interface Pads 5519 and 5519S
Property
Method
Value
Thermal Conductivity (W/mK)Note 2
ASTM D5470
4.9
Flammability
UL 94
V0
Density (g/cm3, @ 25°C)
–
3.1
Hardness
Shore 00Note 1
5519 @ 70
5519S @ 75
Volume Resistivity (Ω-cm)
ASTM D257
1.7 x 1014
Dielectric Strength (kV/mm)
ASTM D149
1.5 (5519S = 3.5 est.)
Dielectric Constant
ASTM D150
19.5 (1-100 kHz)
(2)
Notes:
1) Shore OO Test Method based on a 6mm thick sample. Results will vary for different thickness samples.
2) Thermal conductivity can vary with test method and/or equipment used for testing at different test sites. Thermal K based on testing of the 5519. Effective Thermal
K and Thermal Resistance will be somewhat reduced with the addition of the polymeric film of the 5519S constructions.
Duration (hrs)
Initial
500
1000
3000
Thermal Conductivity (W/mK)
4.9
Hardness (Shore 00)
69
70
Appearance
–
No effect
Aged at 130°C in high temperature chamber.
Note: Thermal Conductivity for aging tested using the QTM-500 Hot Wire Test Method. Values can differ from an ASTM-D5470 TM due to TM differences.
Environmental Aging Data
Heat resistance of 1.0 mm 3M Thermally Conductive Silicone Interface Pad 5519
100%
80%
60%
40%
20%
0%
Co
m
pr
es
si
on
(%
)
3M Thermally Conductive Silicone
Interface Pad 5519 (1 mm)
Rate: 0.5 mm/min
Stress (MPa)
0
1
2
3
4
5
Compression vs. Stress
Note: Compression vs Stress test results can vary between test methods based on sample size, exact test
set-up, equipment type, etc.
3M Thermally Conductive Silicone Interface Pads 5519 and 5519S
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| P51-15-S-J-I12-4.5V-000-000 | SENSOR 15PSI 3/8-24 UNF .5-4.5V |
| P51-500-A-Z-M12-4.5OVP-000-000 | SENSOR 500PSI 1/4-18NPT .5-4.5V |
| P51-3000-S-W-MD-4.5V-000-000 | SENSOR 3000PSI 1/8-27NPT .5-4.5V |
| LT3476EUHF#TRPBF | IC LED DRVR HP CONST CURR 38-QFN |
| GMC06DREH | CONN EDGECARD 12POS .100 EYELET |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| 5519S-210x155-80 | 功能描述:膠帶 THERMAL INTERFACE PAD 210 x 155 x .5mm RoHS:否 制造商:3M Electronic Specialty 產(chǎn)品:Tapes 類型:Shielding 描述/功能:EMI/RFI Foil Shielding Tape 顏色: 材料:Copper Foil 寬度:1 in x 18 yds |
| 5519S-25 | 制造商:3M Electronic Products Division 功能描述:THERMAL INTERFACE PAD 210x155x1.5mm |
| 5519S-2MIL | 功能描述:THERM COND PAD 2.0MM 155MMX210MM 制造商:3m 系列:* 零件狀態(tài):過期 標準包裝:20 |
| 5519S-2ML | 制造商:3M Electronic Products Division 功能描述:5519S THERM COND INT PAD 2MIL WX300909693 |
| 551A | 制造商:Datak Corporation 功能描述:Conn UHF Adapter M/F RA Nickel |
發(fā)布緊急采購，3分鐘左右您將得到回復。