參數(shù)資料
型號: 551002B00000G
廠商: Aavid Thermalloy
文件頁數(shù): 71/116頁
文件大?。?/td> 0K
描述: HEATSINK TO-220 1.45" HIGH
產(chǎn)品培訓模塊: How to Select a Heat Sink
產(chǎn)品目錄繪圖: 551002B00000G
標準包裝: 250
類型: 插件板級
冷卻式包裝: TO-220
固定方法: 把緊螺栓
形狀: 矩形
長度: 1.450"(36.83mm)
寬: 1.006"(25.55mm)
機座外的高度(散熱片高度): 0.787"(19.99mm)
溫升時的功耗: 1.5W @ 20°C
在強制氣流下的熱敏電阻: 在 300 LFM 時為4°C/W
自然環(huán)境下的熱電阻: 12.4°C/W
材質:
材料表面處理: 黑色陽極化處理
產(chǎn)品目錄頁面: 2671 (CN2011-ZH PDF)
相關產(chǎn)品: HS417-ND - MOUNTING KIT TO-220
其它名稱: 002015
551002B00000
HS193
58
THRU
HOLE
DISCRETE
SEMIC
O
NDUCT
O
R
P
A
C
K
A
GES
EUROPE
ASIA
Italy Tel: +39 051 764011 email: sales.it@aavid.com
United Kingdom Tel: +44 1793 401400 email: sales.uk@aavid.com
Singapore Tel: +65 6362 8388 email: sales@aavid.com.sg
Taiwan Tel: +886(2) 2698-9888 email: sales@aavid.com.tw
AMERICA
USA Tel: +1 (603) 224-9988 email: info@aavid.com
www.aavidthermalloy.com
TO-220 & TO-218 & TO-247 Heat Sinks
5130, 5131, 5132, 5133
Extruded heat sink with radial fins
feature equal channel widths on
both sides for single or dual device
mounting. Includes two solderable
mounting pins which permit vertical
mounting and eliminate stress on
device leads. Available in four heights
for TO-220,TO-218, and TO-247 devices.
(0.500)
12.70
(0.125)
3.18
(1.375)
34.92
(0.062)
1.57
(1.000)
25.40
2x
(0.156)
3.96
2x
(0.093)
2.37
"A"
"B"
"C"
17.48
(0.688)
"D"
"E"
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Th
ermal
Resistanc
eF
rom
MT
G
Sur
fac
et
oAmbien
t—°C/W
at
t
10
0
20
40
60
80
100
02
4
6
8
10
8
6
2
4
0
400
200
600
800
1000
51310X
51300X
Moun
ting
Sur
fac
eT
emp
Ri
se
A
bo
ve
Ambien
t—°C
Material: Aluminum
Finish: Black Anodize
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Th
ermal
Resistanc
eF
rom
MT
G
Sur
fac
et
oAmbien
t—°C/W
at
t
5
0
20
40
60
80
100
02
4
6
8
10
4
3
1
2
0
400
200
600
800
1000
51330X
51320X
Moun
ting
Sur
fac
eT
emp
Ri
se
A
bo
ve
Ambien
t—°C
ORDERING INFORMATION
Part Number
Device
“A” Dim
“B” Dim
“C” Dim
“D” Dim
“E” Dim
513001B02500G
TO-218, TO-247
25.40 (1.000)
21.59 (0.850)
3.66 (0.144)
17.02 (0.670)
13.72 (0.540)
2.67 (0.105)
513002B02500G
TO-220
25.40 (1.000)
18.29 (0.720)
3.17 (0.125)
15.88 (0.625)
11.10 (0.437)
2.67 (0.105)
513101B02500G
TO-218, TO-247
38.10 (1.500)
21.59 (0.850)
3.66 (0.144)
17.02 (0.670)
13.72 (0.540)
2.67 (0.105)
513102B02500G
TO-220
38.10 (1.500)
18.29 (0.720)
3.17 (0.125)
15.88 (0.625)
11.10 (0.437)
2.67 (0.105)
513201B02500G
TO-218, TO-247
50.80 (2.000)
21.59 (0.850)
3.66 (0.144)
17.02 (0.670)
13.72 (0.540)
2.67 (0.105)
513202B02500G
TO-220
50.80 (2.000)
18.29 (0.720)
3.17 (0.125)
15.88 (0.625)
11.10 (0.437)
2.67 (0.105)
513301B02500G
TO-218, TO-247
63.50 (2.500)
21.59 (0.850)
3.66 (0.144)
17.02 (0.670)
13.72 (0.540)
2.67 (0.105)
513302B02500G
TO-220
63.50 (2.500)
18.29 (0.720)
3.17 (0.125)
15.88 (0.625)
11.10 (0.437)
2.67 (0.105)
Dia of PCB
Plated Thru
Hole for Pins
BW38, BW50, BW63
Wide extruded heat sink with unequal channel
Wide extruded heat sink with
unequal channel widths on front
and back can accommodate a TO-220,
TO-218, or TO-247 device. Includes two
solderable mounting pins which permit
vertical mounting and eliminate stress
on device leads. Available in three heights.
Versions without hole use clip 6801 (sold
separately) to attach device. See page 97
for clip information.
25.40
(1.000)
4.00
(0.157)
2.60
(0.101)
25.40
(1.000)
21.60
(0.850)
2.00
(0.079)
3.6
(0.144)
"A"
34.90
(1.375)
12.70
(0.500)
Air VelocityFeet Per Minute
Heat DissipatedWatts
Th
ermal
Resistanc
eF
rom
MT
G
Sur
fac
et
oAmbien
t—°
C/W
at
t
10
0
20
40
60
80
100
04
8
12
16
20
8
6
2
4
0
400
200
600
800
1000
BW50
BW63
BW38
Moun
ting
Sur
fac
eT
emp
Ri
se
A
bo
ve
Ambien
t—°
C
Material: Aluminum
Finish: Black Anodize
ORDERING INFORMATION
Part Number
Description
“A” Dim
Holes
BW38-2G
Extruded heat sink with unequal channel widths front and back
38.00 (1.496)
No
3.00 (0.118)
BW38-4G
With device mounting hole
38.00 (1.496)
Yes
3.00 (0.118)
BW50-2G
Extruded heat sink with unequal channel widths front and back
50.00 (1.968)
No
3.00 (0.118)
BW50-4G
With device mounting hole
50.00 (1.968)
Yes
3.00 (0.118)
BW63-2G
Extruded heat sink with unequal channel widths front and back
63.00 (2.480)
No
3.00 (0.118)
BW63-4G
With device mounting hole
63.00 (2.480)
Yes
3.00 (0.118)
Dia of PCB
Plated Thru
Hole for Pins
For additional options see page 83
Grease
Epoxy
&
page112
Mounting
Kits
page 99
Grease
Epoxy
&
page112
Mounting
Kits
page 99
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