參數(shù)資料
型號： 534002B02554G
廠商： Aavid Thermalloy
文件頁數(shù)： 103/116頁
文件大?。?/td> 0K
描述： BOARD LEVEL HEAT SINK
產(chǎn)品培訓(xùn)模塊： How to Select a Heat Sink
標(biāo)準(zhǔn)包裝： 500
類型： 插件板級，垂直
冷卻式包裝： TO-220
固定方法： 夾和 PC 引腳
形狀： 矩形
長度： 2.000"（50.80mm）
寬： 1.375"（34.93mm）
機座外的高度（散熱片高度）： 0.500"（12.70mm）
溫升時的功耗： 2W @ 30°C
在強制氣流下的熱敏電阻： 在 400 LFM 時為5°C/W
自然環(huán)境下的熱電阻： 9°C/W
材質(zhì)： 鋁
材料表面處理： 黑色陽極化處理
其它名稱： 001943
534002B02554
534002B02554-ND
87
INTERF
A
CE
MA
TERIALS
EUROPE
ASIA
Italy Tel: +39 051 764011 email: sales.it@aavid.com
United Kingdom Tel: +44 1793 401400 email: sales.uk@aavid.com
Singapore Tel: +65 6362 8388 email: sales@aavid.com.sg
Taiwan Tel: +886 (2) 2698-9888 email: sales@aavid.com.tw
AMERICA
USA Tel: +1 (603) 224-9988 email: info@aavid.com
www.aavidthermalloy.com
Alignment Pads
Aavid Thermalloy has added a phase change
pad to its line-up. These pads provide low
thermal resistance and electrical isolation
for low pressure spring mount applications.
Above the phase change temperature the
material flows to fill in surface irregularities
and maximize the heat conduction path.
Interface Material/Pads
Solderable alignment pads are an innovative
way to attach the heat sink to your transistor that
could cut your assembly time by more than half.
Alignment pads provide cost effective solderability,
while providing numerous additional benefits.
Alignment pads are factory applied and can be
bought separately as well. Please refer to accessory
Index D on page 85.
Suffix
Device
Figure
8223-CL03G
TO-220
B
8241-CL11G
TO-218
A
Hi-Flow *
(1.000)
25.40
(0.030)
0.76
(0.122)
3.10
(0.985)
25.02
(0.520)
13.21
(1.200)
30.48
(0.860)
21.84
9.40
(0.370)
5.08
(0.200)
3.25
(0.128)
1
CLIP ASSEMBLY
CL
(0.460)
11.68
(0.300)
7.62
(0.670)
17.02
0.51
(0.020)
TYP THK
14.22
(0.560)
3.18
(0.125)
0.76
(0.030)
(0.860)
21.84
5.08
(0.200)
(0.790)
20.07
Figure A
ORDERING INFORMATION
example
Thermalloy origin part 7022B–8223–CL03 G
A
B
A = Model number
B = Alignment pad
C = RoHS compliant
Figure B
Typical installation
Shown with part number 8241-CL11
Recommended hole pattern for 8223-CL03G
Recommended hole pattern for 8241-CL11G
14.73
(0.580)
7.37
(0.290)
2.54
(0.100)
2.54
(0.100)
PLATED THRU HOLE PER
DEVICE MANUFACTURERS
RECOMMENDATION
2.95
(0.116)
DIA PLATED
THRU HOLE
25.40
(1.000)
12.70
(0.500)
5.46
(0.215)
2.95
(0.116)
DIA PLATED
THRU HOLE
5.46
(0.215)
1.60
(0.063)
DIA PLATED
THRU HOLE
TYP(3)
TYP(2)
C
Reinforcement carrier
Polymide
Thickness
0.127 (0.005)
Continuous use temp (°C)
150
Phase change temp(°C)
55
Dielectric breakdown voltage (Vac)
5000
Dielectric constant (1000 Hz)
4.5
Volume resistivity (Ohm-meter)
1012
MATERIAL PROPERTIES
(1.650)
41.91
(1.140)
28.96
2X
(0.093)
2.36
2X
(0.140)
3.56
21.84
(0.860)
18.80
(0.740)
2.69
(0.160)
16.76
(0.660)
DIA
19.05
(0.750)
12.70
(0.500)
3.73
(0.147)
14.30
(0.563)
DIA
TO-3
TO-220
TO-218
530101B _ 5150G
Ordering code
ORDERING INFORMATION
example 12 digit part
Ordering code
Description
0
No pads
7
One Hi-Flow pad
8
Two Hi-Flow pads
The shape and hole pattern of the heat sink will determine the shape and hole
pattern of the pad. If you are ordering a heat sink which mounts to a semicon-
ductor on both sides, the ordering code for two pads should be used. To order
additional Hi-Flow pads separate, or factory applied variations please contact
an Aavid sales rep for inquiries.
Thermal impedance vs. pressure
Pressure
10
25
50
200
TO-220 Thermal performance (C/W)
1.15
1.14
1.12
1.1
* Hi-Flow is a registered trademark of the Bergquist Company
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