• <td id="cyik6"></td>
    參數(shù)資料
    型號： 530102B00150G
    廠商： Aavid Thermalloy
    文件頁數(shù)： 35/116頁
    文件大?。?/td> 0K
    描述： HEAT SINK 1.75" HIGH RISE TO-220
    產(chǎn)品培訓(xùn)模塊： How to Select a Heat Sink
    產(chǎn)品目錄繪圖： 53010(1,2)B00150G
    標(biāo)準(zhǔn)包裝： 500
    類型： 插件板級，垂直
    冷卻式包裝： TO-220
    固定方法： 夾片和電路板安裝
    形狀： 方形
    長度： 1.750"（44.45mm）
    寬： 0.490"（12.44mm）
    機座外的高度（散熱片高度）： 1.750"（44.45mm）
    溫升時的功耗： 4W @ 30°C
    在強制氣流下的熱敏電阻： 在 400 LFM 時為1.5°C/W
    自然環(huán)境下的熱電阻： 6.3°C/W
    材質(zhì)： 鋁
    材料表面處理： 黑色陽極化處理
    產(chǎn)品目錄頁面： 2671 (CN2011-ZH PDF)
    其它名稱： HS343
    25
    THRU
    HOLE
    DISCRETE
    SEMIC
    O
    NDUCT
    O
    R
    P
    A
    C
    K
    A
    GES
    EUROPE
    ASIA
    Italy Tel: +39 051 764011 email: sales.it@aavid.com
    United Kingdom Tel: +44 1793 401400 email: sales.uk@aavid.com
    Singapore Tel: +65 6362 8388 email: sales@aavid.com.sg
    Taiwan Tel: +886(2) 2698-9888 email: sales@aavid.com.tw
    AMERICA
    USA Tel: +1 (603) 224-9988 email: info@aavid.com
    www.aavidthermalloy.com
    7109
    Surface mount heat sink for D
    2 PAK (TO-263) package semiconductors
    Surface mount heat sink for D
    2 PAK
    (TO-263) package semiconductors
    remove the heat indirectly without
    contacting the device like traditional
    through hole heat sinks. The device
    and the heat sink are soldered directly
    to a modified drain pad creating a
    thermal transfer path from package
    tab to the heat sink.
    25.40
    (1.000)
    19.38
    (0.763)
    15.24
    (0.600)
    11.43
    (0.450)
    11.43
    (0.450)
    Air Velocity—Feet Per Minute
    Heat Dissipated—Watts
    Th
    ermal
    Resistanc
    eF
    rom
    MT
    G
    Sur
    fac
    et
    oAmbien
    t—°
    C/W
    at
    t
    5
    0
    20
    40
    60
    80
    100
    01
    2
    3
    4
    5
    4
    3
    1
    2
    0
    400
    200
    600
    800
    1000
    Moun
    ting
    Sur
    fac
    eT
    emp
    Ri
    se
    A
    bo
    ve
    Ambien
    t—°
    C
    1.3
    (0.05)
    12.70
    (0.500)
    10.16
    (0.400)
    7.37
    (0.290)
    30.99
    (1.220)
    17.53
    (0.690)
    Air Velocity—Feet Per Minute
    Heat Dissipated—Watts
    Th
    ermal
    Resistanc
    eF
    rom
    MT
    G
    Sur
    fac
    et
    oAmbien
    t—°
    C/W
    at
    t
    20
    0
    10
    20
    30
    40
    50
    0.0
    0.5
    1.0
    1.5
    2.0
    2.5
    16
    12
    4
    8
    0
    400
    200
    600
    800
    1000
    Ca
    se
    T
    emp
    R
    ise
    Ri
    se
    A
    bo
    ve
    Ambien
    t—°
    C
    Surface mount heat sink for D
    3 PAK
    (TO-268) package semiconductors
    remove the heat indirectly without
    contacting the device like traditional
    through hole heat sinks. The device
    and the heat sink are soldered directly
    to a modified drain pad creating a
    thermal transfer path from package
    tab to the heat sink.
    5734
    Surface mount heat sink for D
    3 PAK (TO-268) package semiconductors
    Tape and Reel information
    Part Number
    “A” Dim
    “B” Dim
    “C” Dim
    “D” Dim
    7106D/TRG
    44.00 (1.730)
    40.40 (1.590)
    24.00 (0.940)
    4.06 (0.160)
    7109D/TRG
    44.00 (1.730)
    40.40 (1.590)
    36.00 (1.420)
    4.06 (0.160)
    573100D00010G
    44.00 (1.730)
    40.40 (1.590)
    16.00 (0.630)
    4.06 (0.160)
    573300D00010G
    44.00 (1.730)
    40.40 (1.590)
    24.00 (0.940)
    4.06 (0.160)
    573400D00010G
    44.00 (1.730)
    40.40 (1.590)
    24.00 (0.940)
    4.06 (0.160)
    ORDERING INFORMATION
    SMT
    ORDERING INFORMATION
    Part Number
    Packaging
    7109D/TRG
    13" Reel, 125 per reel
    7109DG
    Bulk, 500 per bag
    Material: 0.63 (0.025) Thick Copper
    Finish: Tin Plated
    See below for tape and reel information
    Refer to Figure D on page 26 for board footprint information
    ORDERING INFORMATION
    Part Number
    Packaging
    573400D00010G
    13" Reel, 250 per reel
    573400D00000G
    Bulk, 500 per bag
    Material: 0.63 (0.025) Thick Copper
    Finish: Tin Plated
    See below for tape and reel information
    Refer to Figure A and B on page 26 for board footprint information
    A
    B
    C
    D
    相關(guān)PDF資料
    PDF描述
    1554B2GYCL BOX POLY 2.6X2.6X1.6" GR/CL
    1-1393844-7 RELAY GEN PURPOSE 3PDT 16A 24V
    KUMP-14A18-120 RELAY GEN PURPOSE 3PDT 15A 120V
    RM607524 RELAY GEN PURPOSE 3PST 10A 24V
    RM732048 RELAY GEN PURPOSE 3PDT 16A 48V
    相關(guān)代理商/技術(shù)參數(shù)
    參數(shù)描述
    530102B10150G 制造商:Aavid Thermalloy 功能描述:- Bulk
    530-104 制造商:Mitutoyo Corporation 功能描述:VERNIER CALIPER 150MM 制造商:Mitutoyo Corporation 功能描述:VERNIER CALIPER, 150MM 制造商:Mitutoyo Corporation 功能描述:VERNIER CALIPER, 150MM; Instrument Type:Vernier Caliper; Measuring Range Max:150mm; SVHC:No SVHC (19-Dec-2012); Accuracy mm / Inch: 0.05mm; Graduation:0.05mm; Jaw Length:40mm; Measuring Range Min:0mm; Resolution:0.0 ;RoHS Compliant: NA
    530104-1338 制造商:MOLEX 功能描述:
    53011 制造商:ROCOL LTD 功能描述:ROCOL RTD SPRAY 400ML CAN 53011 制造商:Pro Elec 功能描述:12V Universal Power Supply with Six Tips
    5301-1 制造商:Seastrom Mfg 功能描述:
    發(fā)布緊急采購，3分鐘左右您將得到回復(fù)。

    采購需求

    (若只采購一條型號，填寫一行即可)

    發(fā)布成功！您可以繼續(xù)發(fā)布采購。也可以進入我的后臺，查看報價

    發(fā)布成功！您可以繼續(xù)發(fā)布采購。也可以進入我的后臺，查看報價

    *型號 *數(shù)量 廠商 批號 封裝
    添加更多采購

    我的聯(lián)系方式

    *
    *
    *