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參數(shù)資料
| 型號： | 516-AG10D |
| 元件分類： | 插座 |
| 英文描述： | DIP16, IC SOCKET |
| 封裝： | ROHS COMPLIANT |
| 文件頁數(shù)： | 4/4頁 |
| 文件大?。?/td> | 59K |
| 代理商： | 516-AG10D |
516-AG10D Product Details - Tyco Electronics
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http://www.tycoelectronics.com/catalog/bin/T...ect?C=1&M=BYPN&TCPN=1437536-2&RQPN=1437536-2 (4 of 4) [24-Feb-2010 2:27:46 PM]
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相關代理商/技術參數(shù) |
參數(shù)描述 |
|---|---|
| 516-AG10D-ES | 功能描述:IC 與器件插座 USE 571-14375363 RoHS:否 制造商:Molex 產(chǎn)品:LGA Sockets 節(jié)距:1.02 mm 排數(shù): 位置/觸點數(shù)量:2011 觸點電鍍:Gold 安裝風格:SMD/SMT 端接類型:Solder 插座/封裝類型:LGA 2011 工作溫度范圍:- 40 C to + 100 C |
| 516-AG10D-ESL | 制造商:T&B ASSEMBLY - USE 功能描述:Cross Referenced to TE CONNECTIVITY - Part: AMP4-1437531-0 |
| 516-AG10F | 制造商:TE Connectivity 功能描述:DIP SOCKET 16POS THROUGH HOLE 制造商:TE Connectivity 功能描述:DIP SOCKET, 16POS, THROUGH HOLE 制造商:TE Connectivity / AMP 功能描述:DIP SOCKET, 16POS, THROUGH HOLE; Connector Type:DIP Socket; Series:500; No. of Contacts:16; Pitch Spacing:2.54mm; Row Pitch:7.62mm; Contact Termination:Through Hole Vertical; Contact Material:Beryllium Copper; Contact Plating:Gold ;RoHS Compliant: Yes |
| 516-AG11D | 功能描述:IC 與器件插座 GOLD CNT TIN SLV 16P RoHS:否 制造商:Molex 產(chǎn)品:LGA Sockets 節(jié)距:1.02 mm 排數(shù): 位置/觸點數(shù)量:2011 觸點電鍍:Gold 安裝風格:SMD/SMT 端接類型:Solder 插座/封裝類型:LGA 2011 工作溫度范圍:- 40 C to + 100 C |
| 516-AG11D-ES | 功能描述:IC 與器件插座 SOLID FRAME PC 16P RoHS:否 制造商:Molex 產(chǎn)品:LGA Sockets 節(jié)距:1.02 mm 排數(shù): 位置/觸點數(shù)量:2011 觸點電鍍:Gold 安裝風格:SMD/SMT 端接類型:Solder 插座/封裝類型:LGA 2011 工作溫度范圍:- 40 C to + 100 C |
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