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參數(shù)資料
| 型號： | 5082-0002 |
| 英文描述： | PIN Diode Chips for Hybrid MIC Switches/Attenuators(應(yīng)用于混合MIC開關(guān)/衰減器的PIN二極管芯片) |
| 中文描述： | PIN二極管芯片雜交麥克風(fēng)開關(guān)/衰減器（應(yīng)用于混合麥克風(fēng)開關(guān)/衰減器的密碼二極管芯片） |
| 文件頁數(shù)： | 2/2頁 |
| 文件大小： | 31K |
| 代理商： | 5082-0002 |
Electrical Specifications at T
A
= 25
°
C
Nearest
Chip
Equivalent
Part
Packaged
Number
Part No.
5082-
5082-
0001
3041
0012
3001
Test
Conditions
Typical Parameters
Typical
Reverse
Recovery
Time
t
rr
( ns)
5
100
I
F
= 20 mA
V
R
= 10 V
90% Recovery
Minimum
Breakdown
Voltage
V
BR
(V)
70
150
V
R
= V
BR
Measure
I
R
≤
10 mA
Maximum
J unction
Capacitance
C
j
(pF)
0.16*
0.12
V
R
= 50 V
*V
R
= 20 V
f = 1 MHz
Typical
Series
Resistance
R
S
(
)
0.8*
1.0
I
F
= 100 mA
*I
F
= 20 mA
f = 100 MHz
Typical
Lifetime
τ
(ns)
35*
400
I
F
= 50 mA
I
R
= 250 mA
*I
R
= 6 mA
*I
F
= 10 mA
Assembly and Handling
Procedures for PIN Chips
1. Storage
Devices should be stored in a dry
nitrogen purged dessicator or
equivalent.
2. Cleaning
If required, surface contamination
may be removed with electronic
grade solvents. Typical solvents,
such as freon (T.F. or T.M.C.),
acetone, deionized water, and
methanol, or their locally ap-
proved equivalents, can be used
singularly or in combinations.
Typical cleaning times per solvent
are one to three minutes. DI water
and methanol should be used (in
that order) in the final cleans.
Final drying can be accomplished
by placing the cleaned dice on
clean filter paper and drying with
an infrared lamp for 5-10 minutes.
Acids such as hydrofluoric (HF),
nitric (HNO
3
) and hydrochloric
(HCl) should not be used.
The effects of cleaning methods/
solutions should be verified on
small samples prior to submitting
the entire lot.
Following cleaning, dice should
be either used in assembly
(typically within a few hours) or
stored in clean containers in a
reducing atmosphere or a vacuum
chamber.
3. Die Attach
a. Eutectic
5082-0001
AuSn preform with stage tempera-
ture of 300
°
C for one minute max.
5082-0012
AuSn preform with stage tempera-
ture of 310
°
C for one minute max.
AuGe preform with stage tem-
perature of 390
°
C for one minute
max.
b. Epoxy
For epoxy die-attach, conductive
silver-filled or gold-filled epoxies
are recommended. This method
can be used for all Agilent PIN
chips.
4. Wire Bonding
Either ultrasonic or thermo-
compression bonding techniques
can be employed. Suggested wire
is pure gold, 0.7 to 1.5 mil diam-
eter. Ultrasonic bonding method
should be avoided for the
5082-0001 diode chip.
www.semiconductor.agilent.com
Data subject to change.
Copyright 1999 Agilent Technologies
5965-8880E (11/99)
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| 5082-2080 | Passivated General Purpose Schottky Diodes(鈍化通用型肖特基勢壘二極管) |
| 5082-2804 | Passivated General Purpose Schottky Diodes(鈍化通用型肖特基勢壘二極管) |
| 5082-2805 | Passivated General Purpose Schottky Diodes(鈍化通用型肖特基勢壘二極管) |
| 5082-2811 | Passivated General Purpose Schottky Diodes(鈍化通用型肖特基勢壘二極管) |
| 5082-2815 | Passivated General Purpose Schottky Diodes(鈍化通用型肖特基勢壘二極管) |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| 5082-0008 | 制造商:ASI 制造商全稱:ASI 功能描述:STEP RECOVERY DIODE CHIP |
| 5082-0008_04 | 制造商:ASI 制造商全稱:ASI 功能描述:STEP RECOVERY DIODE CHIP |
| 5082-0012 | 功能描述:PIN 二極管 150 VBR 0.12 pF RoHS:否 制造商:Skyworks Solutions, Inc. 配置: 反向電壓:200 V 正向連續(xù)電流: 頻率范圍:10 MHz to 6 GHz 端接類型:SMD/SMT 封裝 / 箱體:QFN-3 封裝:Reel |
| 5082-0031 | 制造商:Hewlett Packard Co 功能描述:5082-0031 |
| 5082-0112 | 制造商:ASI 制造商全稱:ASI 功能描述:GLASS PACKAGE STEP RECOVERY DIODE |
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