參數(shù)資料
型號: 507002B00000G
廠商: Aavid Thermalloy
文件頁數(shù): 35/116頁
文件大?。?/td> 0K
描述: HEATSINK TO-220 BLK
產(chǎn)品培訓(xùn)模塊: How to Select a Heat Sink
產(chǎn)品目錄繪圖: 507002B00000G
標(biāo)準(zhǔn)包裝: 1,000
類型: 插件板級
冷卻式包裝: TO-220
固定方法: 把緊螺栓
形狀: 矩形
長度: 0.700"(17.78mm)
寬: 1.750"(44.45mm)
機(jī)座外的高度(散熱片高度): 0.375"(9.52mm)
溫升時(shí)的功耗: 2W @ 40°C
在強(qiáng)制氣流下的熱敏電阻: 在 500 LFM 時(shí)為5°C/W
自然環(huán)境下的熱電阻: 15.6°C/W
材質(zhì):
材料表面處理: 黑色陽極化處理
產(chǎn)品目錄頁面: 2672 (CN2011-ZH PDF)
相關(guān)產(chǎn)品: HS417-ND - MOUNTING KIT TO-220
其它名稱: 507002B00000
5070B
6070B
HS112
25
THRU
HOLE
DISCRETE
SEMIC
O
NDUCT
O
R
P
A
C
K
A
GES
EUROPE
ASIA
Italy Tel: +39 051 764011 email: sales.it@aavid.com
United Kingdom Tel: +44 1793 401400 email: sales.uk@aavid.com
Singapore Tel: +65 6362 8388 email: sales@aavid.com.sg
Taiwan Tel: +886(2) 2698-9888 email: sales@aavid.com.tw
AMERICA
USA Tel: +1 (603) 224-9988 email: info@aavid.com
www.aavidthermalloy.com
7109
Surface mount heat sink for D
2 PAK (TO-263) package semiconductors
Surface mount heat sink for D
2 PAK
(TO-263) package semiconductors
remove the heat indirectly without
contacting the device like traditional
through hole heat sinks. The device
and the heat sink are soldered directly
to a modified drain pad creating a
thermal transfer path from package
tab to the heat sink.
25.40
(1.000)
19.38
(0.763)
15.24
(0.600)
11.43
(0.450)
11.43
(0.450)
Air VelocityFeet Per Minute
Heat DissipatedWatts
Th
ermal
Resistanc
eF
rom
MT
G
Sur
fac
et
oAmbien
t—°
C/W
at
t
5
0
20
40
60
80
100
01
2
3
4
5
4
3
1
2
0
400
200
600
800
1000
Moun
ting
Sur
fac
eT
emp
Ri
se
A
bo
ve
Ambien
t—°
C
1.3
(0.05)
12.70
(0.500)
10.16
(0.400)
7.37
(0.290)
30.99
(1.220)
17.53
(0.690)
Air VelocityFeet Per Minute
Heat DissipatedWatts
Th
ermal
Resistanc
eF
rom
MT
G
Sur
fac
et
oAmbien
t—°
C/W
at
t
20
0
10
20
30
40
50
0.0
0.5
1.0
1.5
2.0
2.5
16
12
4
8
0
400
200
600
800
1000
Ca
se
T
emp
R
ise
Ri
se
A
bo
ve
Ambien
t—°
C
Surface mount heat sink for D
3 PAK
(TO-268) package semiconductors
remove the heat indirectly without
contacting the device like traditional
through hole heat sinks. The device
and the heat sink are soldered directly
to a modified drain pad creating a
thermal transfer path from package
tab to the heat sink.
5734
Surface mount heat sink for D
3 PAK (TO-268) package semiconductors
Tape and Reel information
Part Number
“A” Dim
“B” Dim
“C” Dim
“D” Dim
7106D/TRG
44.00 (1.730)
40.40 (1.590)
24.00 (0.940)
4.06 (0.160)
7109D/TRG
44.00 (1.730)
40.40 (1.590)
36.00 (1.420)
4.06 (0.160)
573100D00010G
44.00 (1.730)
40.40 (1.590)
16.00 (0.630)
4.06 (0.160)
573300D00010G
44.00 (1.730)
40.40 (1.590)
24.00 (0.940)
4.06 (0.160)
573400D00010G
44.00 (1.730)
40.40 (1.590)
24.00 (0.940)
4.06 (0.160)
ORDERING INFORMATION
SMT
ORDERING INFORMATION
Part Number
Packaging
7109D/TRG
13" Reel, 125 per reel
7109DG
Bulk, 500 per bag
Material: 0.63 (0.025) Thick Copper
Finish: Tin Plated
See below for tape and reel information
Refer to Figure D on page 26 for board footprint information
ORDERING INFORMATION
Part Number
Packaging
573400D00010G
13" Reel, 250 per reel
573400D00000G
Bulk, 500 per bag
Material: 0.63 (0.025) Thick Copper
Finish: Tin Plated
See below for tape and reel information
Refer to Figure A and B on page 26 for board footprint information
A
B
C
D
相關(guān)PDF資料
PDF描述
RT1202B7TR7 RES NET 33 OHM 16 RES 32-TBGA
1776493-9 TERMINAL BLOCK 9POS 5.08MM SIDE
1776493-8 TERMINAL BLOCK 8POS 5.08MM SIDE
574502B00000G HEATSINK TO-220 VERT MNT .75"
1776493-7 TERMINAL BLOCK 7POS 5.08MM SIDE
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507002B05300G 功能描述:散熱片 WIDE HAT SECT H/S TO-220 17.78mm BLK RoHS:否 制造商:Ampro By ADLINK 產(chǎn)品:Heat Sink Accessories 安裝風(fēng)格:Through Hole 散熱片材料: 散熱片樣式: 熱阻: 長度: 寬度: 高度: 設(shè)計(jì)目的:Express-HRR