參數(shù)資料
型號： 501906B00000G
廠商： Aavid Thermalloy
文件頁數(shù)： 16/116頁
文件大?。?/td> 0K
描述： BOARD LEVEL HEAT SINK
產(chǎn)品培訓模塊： How to Select a Heat Sink
標準包裝： 500
類型： 插件板級
冷卻式包裝： TO-66
固定方法： 把緊螺栓
形狀： 菱形
長度： 1.55"（39.37mm）
寬： 1.040"（26.42mm）
機座外的高度（散熱片高度）： 1.000"（25.40mm）
溫升時的功耗： 4W @ 40°C
在強制氣流下的熱敏電阻： 在 300 LFM 時為4°C/W
自然環(huán)境下的熱電阻： 8°C/W
材質(zhì)： 鋁
材料表面處理： 黑色陽極化處理
其它名稱： 001205
112
A
C
CESSORIES
EUROPE
ASIA
Italy Tel: +39 051 764011 email: sales.it@aavid.com
United Kingdom Tel: +44 1793 401400 email: sales.uk@aavid.com
Singapore Tel: +65 6362 8388 email: sales@aavid.com.sg
Taiwan Tel: +886 (2) 2698-9888 email: sales@aavid.com.tw
AMERICA
USA Tel: +1 (603) 224-9988 email: info@aavid.com
www.aavidthermalloy.com
Sil-Free
TM 1020 is a metal-oxide-filled, silicone-free synthetic grease
specially formulated to enhance heat transfer across the interface
between the semiconductor case and the heat sink without the
migration or contamination associated with silicone-based products.
Dry interface case-to-sink thermal resistance is typically reduced
50% to 75% with proper application of Sil-Free
TM 1020.
This virtually "no-bleed", high-performance compound will not dry
out, harden, melt, or run, even after long-term continuous exposure
to temperatures up to 200°C. Even in a vacuum atmosphere (10-5
Torr, 24 hours@100°C), Sil-Free
TM 1020 exhibits virtually "no bleed"
or evaporation.
ORDERING INFORMATION
Sil-Free
TM
Part number
Package
Size
101700F00000G
Syringe
43 grams (1.5 oz)
101800F00000G
Tube
57 grams (2.0 oz)
101900F00000G
Jar
57 grams (2.0 oz)
102000F00000G
Tube
143 grams (5.0 oz)
102100F00000G
Jar
457 grams (16.0 oz)
Color
White
Thermal
0.79 W/(m-°C)
conductivity
Operating
-40°C to +200°C
temperature range
Volume
1012 Ohm-cm 2.3 ± 0.5
Weight
47.5 grams
Dielectric strength
225 volts/mil
Consistency
Paste
Bleed
0.09 max
% after 24hr @ 200°C
Specific gravity
2.8 ± 0.2
Shelf life
Indefinite
(unopened)*
Ther-O-Link
TM is a silicone-based thermal compound that
cost effectively enhances the heat transfer between a semi-
conductor case and a heat sink. Easy to apply, Ther-O-Link
TM
substantially reduces dry interface thermal resistance, while
providing long life under a variety of conditions.
ORDERING INFORMATION
Ther-O-Link
TM
Part number
Package
Size
100000F00000G
Ampule
1 gram (0.03 oz)
100100F00000G
Syringe
35.7 grams (1.25 oz)
100200F00000G
Tube
57 grams (2.0 oz)
100500F00000G
Tube
143 grams (5.0 oz)
100800F00000G
Tube
228.6 grams (8.0 oz)
101600F00000G
Can
0.45 kg (1 lb)
108000F00000G
Can
2.27 kg (5 lb)
132000F00000G
Can
9.07 kg (20 lb)
Color
White
Thermal conductivity
0.73 W/(m-°C)
Operating
-40°C to +200°C
temperature range
Volume resistivity
1.0 x 1015 Ohm-cm
Dielectric strength
250 volts/mil
Consistency
Paste
Bleed
0.6 max
Specific gravity
2.8
Shelf life
Indefinite (unopened)*
Aavid's Ultrastick
TM is a unique phase-change thermal inter-
face material that surpasses grease in thermal performance
and long-term stability. This solid, silicone-free, paraffin-
based thermal compound changes phase at 60°C, with a
concurrent volumetric expansion that fills gaps between the
mating surfaces. Ultrastick
TM comes in a convenient applica-
tor bar, allowing for neat, fast application to both heat sink
and component surfaces. One cost-effective application
leaves a thin, film-like deposit, providing excellent heat
transfer and low interface thermal resistance.
Ultrastick
TM
Temperature range
-40°C to +200°C
Volume resistivity
1.0 X 1.015 Ohm-cm
Dielectric strength
250 volts/mil
Consistency
Paste
Bleed
0.6 max
Specific gravity
0.28
Color
Opaque White
Thermal resistance
0.03°C/W per square inch @ 20 psi
0.02°C/W per square inch @ 100 psi
Shelf life
Indefinite*
Grease & Epoxy
ORDERING INFORMATION
Part number
Package
Size
100300F00000G
Bar
47.5 grams (0.16 oz)
PRODUCT INFORMATION
* Recommended max. storage temperature: 40C (105F)
* It is recommended that the containers be turned over
every 6 months to minimize settling for ease of mixing
* It is recommended that the containers be turned over
every 6 months to minimize settling for ease of mixing
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