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參數(shù)資料
| 型號： | 4951G |
| 廠商： | Aavid Thermalloy |
| 文件頁數(shù)： | 106/116頁 |
| 文件大?。?/td> | 0K |
| 描述： | THERMAL EPOXY |
| MSDS 材料安全數(shù)據(jù)表： | 4951A THERMALBOND MSDS 4951B THERMALBOND MSDS |
| 標(biāo)準(zhǔn)包裝： | 1 |
| 系列： | Thermalbond™ |
| 類型： | 環(huán)氧樹脂硬化劑 |
| 尺寸/尺寸： | 3.5 盎司包裝 |
| 其它名稱： | 033869 |
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9
HO
W
T
O
S
ELECT
A
HEA
T
SINK
EUROPE
ASIA
Italy Tel: +39 051 764011 email: sales.it@aavid.com
United Kingdom Tel: +44 1793 401400 email: sales.uk@aavid.com
Singapore Tel: +65 6362 8388 email: sales@aavid.com.sg
Taiwan Tel: +886(2) 2698-9888 email: sales@aavid.com.tw
AMERICA
USA Tel: +1 (603) 224-9988 email: info@aavid.com
www.aavidthermalloy.com
The basic equation for heat transfer or power dissipation may be stated as follows:
Where:
PD = the power dissipated by the semiconductor device in watts.
ΔT = the temperature difference of driving potential which causes the flow of heat.
ΣRθ = the sum of the thermal resistances of the heat flow path across which ΔT exists.
The above relationship may be stated in the following forms:
The above equations are generally used to determine the required thermal resistance of the heat sink (RθSA),
since the heat dissipation, maximum junction and/or case temperature, and ambient temperature are known or set.
How To Select a Heat Sink
Where:
TJ = the junction temperature in °C (maximum is usually stated by the manufacturer of the semiconductor device).
TC = case temperature of the semiconductor device in °C.
TS = temperature of the heat sink mounting surface in thermal contact with the semiconductor device in °C.
TA = ambient air temperature in °C.
RθJC = thermal resistance from junction to case of the semiconductor device in °C per watt
(usually stated by manufacturer of semiconductor device).
RθCS = thermal resistance through the interface between the semiconductor device
and the surface on which it is mounted in °C per watt.
RθSA = thermal resistance from mounting surface to ambient or thermal resistance of heat sink in °C per watt.
Figure 1 indicates the location of the various heat
flow paths, temperatures and thermal resistances.
The common practice is to represent the system with
a network of resistances in series as shown in Figure 2.
Atmosphere
or ambient
Mounting surface
(cooler/dissipator)
Semiconductor case
Junction
(heat source)
Interface
Heat flow path mounting
surface to ambient, equation (3)
Heat flow path case
to ambient equation (2)
Heat flow path junction
to ambient, equation (1)
P
D
P
D
T
A
R
θSA
R
θCS
R
θJC
T
S
T
C
T
A
T
J
TJ–TA
PD =
RθJC + RθCS + RθSA
TC–TA
PD =
RθCS + RθSA
TS–TA
PD =
RθSA
Δ T
PD =
ΣRθ
RθCS
RθJC
TS
TA
TJ
RθSA
TC
FIGURE 1
FIGURE 2
How to select a heat sink
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相關(guān)代理商/技術(shù)參數(shù) |
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|---|---|
| 4951TKG003A | 制造商:LG Corporation 功能描述:METAL ASSEMBLY |
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| 4951TKK013D | 制造商:LG Corporation 功能描述:METAL ASSY |
| 4951TKK014A | 制造商:LG Corporation 功能描述:METAL ASSY |
| 4951TKK015B | 制造商:LG Corporation 功能描述:METAL ASSY |
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