
Part No. 44-PQ505-X10
PQFP to PGA .0315 [.80] Pitch Adapter
Note: Aries specializes in custom design and production. In addition to the
standard products shown on this page, special materials, platings, sizes, and
configurations can be furnished, depending on quantities. Aries reserves the
right to change product specifications without notice.
FEATURES:
Convert surface mount PQFP packages to a PGA
footprint.
Available with or without .020 [.51] high stand-offs.
Consult factory for panelized form or for mounting of
consigned chips.
SPECIFICATIONS:
Adapter body is FR-4, .062 [1.58] thick, with
1 ounce minimum Copper traces.
Pads are hot-air solder leveled.
Pins are Brass Alloy 360 1/2 hard per UNS C36000
ASTM-B16-85.
Pin plating is 200
μ
[5.08
μ
m] min.Tin per MIL-T-10727
Type 1 or Tin/Lead 90/10 MIL-P-81728 over 100
μ
[2.54
μ
m] Nickel per QQ-N-290.
Operating temperature=221°F [105°C].
MOUNTING CONSIDERATIONS:
Suggested PCB hole size=.028 ± .003 [.71 ± .08] dia.
Will plug into standard PGA sockets.
A
LL DIMENSIONS
:
INCHES
[
MILLIMETERS
]
44-PQ505-X10
ORDERING INFORMATION
All tolerances ± .005 [.13]
unless otherwise specified
X-RAY VIEW TOP SIDE
PQFP PAD ASSIGNMENT
TOP (PQFP) SIDE
No. of
pins
Series
Tin plating
Solder tail pin
Stand-off option:
0=without stand-
offs
1=with stand-offs
Consult factory for
other sizes and
configurations.
Specify Part Number 44-PGM08005-30
for wire wrap PGA socket
PRINTOUTS OF THIS DOCUMENT MAY BE OUT OF DATE AND SHOULD BE CONSIDERED UNCONTROLLED
18029
REV.H
NORTH AMERICA
Frenchtown, NJ USA
TEL:(908) 996-6841
FAX:(908) 996-3891
EUROPE
TEL: +44 870 240 0249
FAX: +44 871 919 6033
europe@arieselec.com
http://www.arieselec.com info@arieselec.com
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