參數(shù)資料
型號: 4322-021-00900
英文描述: Dual/Triple Ultra-Low-Voltage SOT23 µP Supervisory Circuits
中文描述: 夾具交聯(lián)蒙脫土- EFD10
文件頁數(shù): 4/38頁
文件大?。?/td> 1231K
代理商: 4322-021-00900
Philips Magnetic Products
3
Introduction
With its new range of surface-mount coil formers, Philips
Components offers a real solution to circuit designers
wishing to take maximum advantage of surface-mount
technology in their designs.
The trend toward full surface-mount technology has been
hampered by the problems of introducing inductive
components (inductors and transformers for example) in
surface-mount execution.
These devices, consisting of cores, coil-formers and
windings held together by clips, were not easily converted
to surface-mount versions, and former designs, based on
"gull-wing" terminations (see Fig.1) have not been entirely
satisfactory.
Disadvantages of "gull-wing" pins
In particular, tensions introduced by the winding wire,
which is wrapped around the upper part of the gull-wing
terminations, can severely degrade the coplanarity of the
solder pads. The use of thin wire windings is a partial
solution to this problem but this introduces limitations on
coil design. Furthermore, during soldering of the winding
wire to the termination, spillage of solder onto the solder
pad can further degrade coplanarity. However, for very
small coil formers gull-wing pins are the only possible
design due to space limitations. For small to medium sized
coil formers there is a better solution: U-pins.
> 0.1 mm
Fig.1 The “gull-wing” design.
相關PDF資料
PDF描述
4322-021-00910 CLAMP CLM-EFD12
43220213430 Dual/Triple Ultra-Low-Voltage SOT23 µP Supervisory Circuits
4322-021-34540 BOBBIN RM6 1SEC 6PIN
4322-021-34560 BOBBIN RM6 2SEC 6PIN
43220205265 CORE FULL EFD 10 3F4 PAIR
相關代理商/技術參數(shù)
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432202100911 制造商:Yageo / Ferroxcube 功能描述:
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