參數(shù)資料
型號： 371824B00034G
廠商： Aavid Thermalloy
文件頁數(shù)： 39/116頁
文件大?。?/td> 0K
描述： HEATSINK BGA W/ADHESIVE TAPE
產(chǎn)品培訓(xùn)模塊： How to Select a Heat Sink
產(chǎn)品目錄繪圖： 3(3,6,7)xx24B Series
(3747,3718)24B000(32,34)G Top
371824B00034G Side
標(biāo)準(zhǔn)包裝： 910
類型： 頂部安裝
冷卻式包裝： BGA
固定方法： 散熱帶，粘合劑（含）
形狀： 方形，鰭片
長度： 1.378"（35.00mm）
寬： 1.378"（35.00mm）
機座外的高度（散熱片高度）： 0.275"（7.00mm）
溫升時的功耗： 1.5W @ 50°C
在強制氣流下的熱敏電阻： 在 200 LFM 時為9.7°C/W
自然環(huán)境下的熱電阻： 31.9°C/W
材質(zhì)： 鋁
材料表面處理： 黑色陽極化處理
產(chǎn)品目錄頁面： 2673 (CN2011-ZH PDF)
其它名稱： HS393
29
THRU
HOLE
DISCRETE
SEMIC
O
NDUCT
O
R
P
A
C
K
A
GES
EUROPE
ASIA
Italy Tel: +39 051 764011 email: sales.it@aavid.com
United Kingdom Tel: +44 1793 401400 email: sales.uk@aavid.com
Singapore Tel: +65 6362 8388 email: sales@aavid.com.sg
Taiwan Tel: +886(2) 2698-9888 email: sales@aavid.com.tw
AMERICA
USA Tel: +1 (603) 224-9988 email: info@aavid.com
www.aavidthermalloy.com
7022
Channel style heat sink with folded back fins
5510
High performance channel style heat sink with folded back fins
High performance channel style
heat sink with folded back fins
for greater cooling capacity in a
minimum of space when mounted
horizontally. Folded back fin design
maximizes surface area without
increasing the vertical space
required by the heat sink.
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal
Resistance
From
MTG
Surface
to
Ambient—
°
C/Watt
10
0
20
40
60
80
100
01
2
3
4
5
8
6
2
4
0
400
200
600
800
1000
Mounting
Surface
Temp
Rise
Above
Ambient—
°
C
Part Number
Description
551002B00000G
High performance channel style heat sink with folded back fins
ORDERING INFORMATION
25.55
(1.006)
13.21
(0.520)
19.99
(0.787)
3.68
(0.145)
THRU
36.83
(1.450)
13.46
(0.530)
9.91
(0.390)
12.78
(0.503)
CL
13.46
(0.530)
Material: 1.27 (0.050) Thick Aluminum
Finish: Black Anodize
TO-220 Heat Sinks
Position
Code
Description
Details
A
01
6-32 Wave On threaded insert
Page 89
0.100 stand off
POPULAR OPTIONS:
Channel style heat sink with
folded back fins for increased
cooling surface area. Available
with tin plated solderable tabs
for easy attachment to the
printed circuit card.
9.52
(0.375)
50.44
(1.986)
23.01
(0.906)
49.99
(1.968)
3.81
(0.150)
21.03
(0.828)
2x 3.81
(0.150)
2.02
(0.080)
2.67
(0.105)
24.16
(0.951)
4.83
(0.190)
3.18
(0.125)
2.29
(0.090)
2x
4.44
(0.175)
2x 2.03
(0.080)
"X"
14.48
(0.570)
TAB
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal
Resistance
From
MTG
Surface
to
Ambient—
°
C/Watt
5
0
20
40
60
80
100
04
8
12
16
20
4
3
1
2
0
400
200
600
800
1000
Mounting
Surface
Temp
Rise
Above
Ambient—
°
C
Part Number
Description
Finish
7022BG
Channel heat sink with no solderable tabs
Black anodize
7022PBG
Channel heat sink with no solderable tabs
Pre black anodize*
7022B-MTG
With solderable tabs
Black anodize
2.90 ( 0.114)
7022PB-MTG
With solderable tabs
Pre black anodize*
2.90 ( 0.114)
ORDERING INFORMATION
Material: 1.27 (0.050) Thick Aluminum
Finish: See Table
* Edges cut during the manufacturing process will be unfinished.
See page 110 for more information
Position
Code
Description
Location
Details
A
TC11-MT
Insulated device mounting clip for T0-220 and solderable tabs
Hole X
Page 93, 98
POPULAR OPTIONS:
Dia of PCB
Plated Thru
Hole for Tabs
Base part no.
A
7022B-
G
Base part no.
A
551002B0 00 00G
For additional options see page 85
For additional options see page 82
Grease
Epoxy
&
page112
Mounting
Kits
page 99
Grease
Epoxy
&
page112
Mounting
Kits
page 99
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