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參數(shù)資料
| 型號： | 3155-0-00-01-00-00-03-0 |
| 廠商： | MILL-MAX MFG CORP |
| 元件分類： | 終端 |
| 英文描述： | PHOSPHOR BRONZE, TIN LEAD (200) OVER NICKEL FINISH, PCB TERMINAL |
| 文件頁數(shù)： | 1/2頁 |
| 文件大?。?/td> | 88K |
| 代理商： | 3155-0-00-01-00-00-03-0 |
ProductNumber:3155-0-00-01-00-00-03-0
Description:
3155
- Solderless Pressfit PCB Pin
Packaging:
Packaged in Bulk
Mill-Max
Part
Number
ShellPlating
ContactPlating
RoHS
Compliant
3155-0-00-01-00-00-03-0
200 - 300 μ" Tin/Lead over Nickel
00
SHELLMATERIAL:
PhosphorBronze
(UNS C54400) per ASTM B 139
PropertiesofPhosphorBronze:
Used for pins requiring more durability than Brass.
Stock diameters available.072/.078"
Chemical composition: Cu 88%, Sn 4%, Zn 4%, Pb 4%
Hardness as machined: 83 Rockwell B
Density: .321 lbs/in3
Electrical conductivity: 19% IACS*
Melting point: 1000°C/930°C (liquidus/solidus)
(3 to 4% lead is used to permit "free machining" and is permitted by EC Directive 2002/95Annex 6; so all pin materials
are RoHS compliant)
*International Annealed Copper Standard, i.e. as a % of pure copper.
CertificateofCompliance:
This is to Certify that the product described above is manufactured to Mill-Max quality standards in accordance with all
applicable specifications and drawing. Mill-Max certifies this product to be free from defects of materials and workmanship.
This Certificate of Compliance covers the following requirements:
Dimensional (all features verified to be within tolerances described on the applicable drawing).
Raw Material (materials and properties verified to be as described on the applicable drawing).
Plating (platings as required, thickness verified, and performance including solderability per mil-standard).
Performance (insertion extraction or other force requirements as described on the applicable drawing).
ComplianceStatementforRegistration,Evaluation,AuthorizationandRestrictionofChemicals(REACH)
Mill-Max Mfg. Corp. Datasheet — Last Modified 2/18/2011
Page 1 of 2
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