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PACKAGING INFORMATION
Orderable Device
Status
(1)
Package
Type
CDIP
LCCC
CDIP
CFP
LCCC
CDIP
CFP
CDIP
CDIP
PDIP
Package
Drawing
J
FK
J
W
FK
J
W
J
J
N
Pins Package
Qty
1
1
1
1
1
1
1
1
1
25
Eco Plan
(2)
Lead/Ball Finish
MSL Peak Temp
(3)
5962-8771101EA
76042012A
7604201EA
7604201FA
JM38510/31402B2A
JM38510/31402BEA
JM38510/31402BFA
SN54221J
SN54LS221J
SN74221N
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
16
20
16
16
20
16
16
16
16
16
None
None
None
None
None
None
None
None
None
Pb-Free
(RoHS)
Pb-Free
(RoHS)
Pb-Free
(RoHS)
Pb-Free
(RoHS)
Pb-Free
(RoHS)
None
Pb-Free
(RoHS)
None
None
None
None
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CU NIPDAU
Level-NC-NC-NC
Level-NC-NC-NC
Level-NC-NC-NC
Level-NC-NC-NC
Level-NC-NC-NC
Level-NC-NC-NC
Level-NC-NC-NC
Level-NC-NC-NC
Level-NC-NC-NC
Level-NC-NC-NC
SN74LS221D
ACTIVE
SOIC
D
16
40
CU NIPDAU
Level-2-260C-1 YEAR/
Level-1-235C-UNLIM
Level-2-260C-1 YEAR/
Level-1-235C-UNLIM
Level-2-260C-1 YEAR/
Level-1-235C-UNLIM
Level-NC-NC-NC
SN74LS221DBR
ACTIVE
SSOP
DB
16
2000
CU NIPDAU
SN74LS221DR
ACTIVE
SOIC
D
16
2500
CU NIPDAU
SN74LS221N
ACTIVE
PDIP
N
16
25
CU NIPDAU
SN74LS221N3
SN74LS221NSR
OBSOLETE
ACTIVE
PDIP
SO
N
NS
16
16
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Level-2-260C-1 YEAR/
Level-1-235C-UNLIM
Level-NC-NC-NC
Level-NC-NC-NC
Level-NC-NC-NC
Level-NC-NC-NC
2000
SNJ54221J
SNJ54LS221FK
SNJ54LS221J
SNJ54LS221W
ACTIVE
ACTIVE
ACTIVE
ACTIVE
CDIP
LCCC
CDIP
CFP
J
16
20
16
16
1
1
1
1
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FK
J
W
(1)
The marketing status values are defined as follows:
ACTIVE:
Product device recommended for new designs.
LIFEBUY:
TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND:
Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW:
Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE:
TI has discontinued the production of the device.
(2)
Eco Plan - May not be currently available - please check
for the latest availability information and additionalproduct content details.
None:
Not yet available Lead (Pb-Free).
Pb-Free (RoHS):
TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Green (RoHS & no Sb/Br):
TI defines "Green" to mean "Pb-Free" and in addition, uses package materials that do not contain halogens,
including bromine (Br) or antimony (Sb) above 0.1% of total product weight.
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDECindustry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:
The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
PACKAGE OPTION ADDENDUM
www.ti.com
28-Feb-2005
Addendum-Page 1