- 您現(xiàn)在的位置：買賣IC網(wǎng) > PDF目錄357262 > 30SPA0557 27000 MHz - 32000 MHz RF/MICROWAVE WIDE BAND HIGH POWER AMPLIFIER PDF資料下載
參數(shù)資料
| 型號： | 30SPA0557 |
| 元件分類： | 放大器 |
| 英文描述： | 27000 MHz - 32000 MHz RF/MICROWAVE WIDE BAND HIGH POWER AMPLIFIER |
| 封裝： | DIE-14 |
| 文件頁數(shù)： | 3/5頁 |
| 文件大?。?/td> | 401K |
| 代理商： | 30SPA0557 |
1
2
3
4
5
6
7
8
9
10
11
12
13
14
RF In
RF Out
Vg3
Vg2
Vg1
Vd1
Vd2
Vd3
2.000
(0.079)
Pepoducion
1
2
3
4
5
6
7
8
9
10
11
12
13
0.818
(0.032)
1.218
(0.048)
1.618
(0.064)
2.418
(0.095)
3.218
(0.127)
2.818
(0.111)
2.418
(0.095)
1.618
(0.064)
1.218
(0.048)
(Note: Engineering designator is 30SPA0557)
0.818
(0.032)
0.0
0.0
1.000
(0.039)
14
2.818
(0.111)
3.218
(0.127)
1.000
(0.039)
3.700
(0.146)
30SPA0557
27.0-32.0 GHz GaAs MMIC
Power Amplifier
May 2005 - Rev 20-May-05
Mechanical Drawing
Bias Arrangement
Bypass Capacitors
- See App Note [2]
Units: millimeters (inches) Bond pad dimensions are shown to center of bond pad.
Thickness: 0.110 +/- 0.010 (0.0043 +/- 0.0004), Backside is ground, Bond Pad/Backside Metallization: Gold
All DC Bond Pads are 0.100 x 0.100 (0.004 x 0.004). All RF Bond Pads are 0.100 x 0.200 (0.004 x 0.008)
Bond pad centers are approximately 0.109 (0.004) from the edge of the chip.
Dicing tolerance: +/- 0.005 (+/- 0.0002). Approximate weight: 4.588 mg.
Bond Pad #1 (RF In)
Bond Pad #2 (Vg1A)
Bond Pad #3 (Vd1A)
Bond Pad #4 (Vg2A)
Bond Pad #5 (Vd2A)
Bond Pad #6 (Vg3A)
Bond Pad #7 (Vd3A)
Bond Pad #8 (RF Out)
Bond Pad #9 (Vd3B)
Bond Pad #10 (Vg3B)
Bond Pad #11 Vd2B)
Bond Pad #12 (Vg2B)
Bond Pad #13 (Vd1B)
Bond Pad #14 (Vg1B)
Page 3 of 5
Mimix Broadband, Inc., 10795 Rockley Rd., Houston, Texas 77099
Tel: 281.988.4600 Fax: 281.988.4615 mimixbroadband.com
Characteristic Data and Specifications are subject to change without notice.
2005 Mimix Broadband, Inc.
Export of this item may require appropriate export licensing from the U.S. Government. In purchasing these parts, U.S. Domestic customers accept
their obligation to be compliant with U.S. Export Laws.
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| 30WQ04FNPBF | 3.5 A, 40 V, SILICON, RECTIFIER DIODE, TO-252AA |
| 30WQ05F | 3.3 A, 50 V, SILICON, RECTIFIER DIODE, TO-252AA |
| 30WQ06FNTRPBF | 3.5 A, 60 V, SILICON, RECTIFIER DIODE, TO-252AA |
| 30WQ06FNTRRPBF | 60 V, SILICON, RECTIFIER DIODE |
| 30WQ06FNPBF | 3.5 A, 60 V, SILICON, RECTIFIER DIODE, TO-252AA |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| 30SRC250 | 功能描述:保險絲 54/107318 30A (10) RoHS:否 制造商:Littelfuse 產(chǎn)品:Surface Mount Fuses 電流額定值:0.5 A 電壓額定值:600 V 保險絲類型:Fast Acting 保險絲大小/組:Nano 尺寸:12.1 mm L x 4.5 mm W 安裝風(fēng)格: 端接類型:SMD/SMT 系列:485 |
| 30SRC750 | 功能描述:保險絲 54/107340 30A (10) RoHS:否 制造商:Littelfuse 產(chǎn)品:Surface Mount Fuses 電流額定值:0.5 A 電壓額定值:600 V 保險絲類型:Fast Acting 保險絲大小/組:Nano 尺寸:12.1 mm L x 4.5 mm W 安裝風(fēng)格: 端接類型:SMD/SMT 系列:485 |
| 30SRF1000 | 功能描述:保險絲 30A 1200VDC TRACTION RoHS:否 制造商:Littelfuse 產(chǎn)品:Surface Mount Fuses 電流額定值:0.5 A 電壓額定值:600 V 保險絲類型:Fast Acting 保險絲大小/組:Nano 尺寸:12.1 mm L x 4.5 mm W 安裝風(fēng)格: 端接類型:SMD/SMT 系列:485 |
| 30ST200U | 功能描述:可復(fù)位保險絲 PTC 30V POLYFUSE STRAP TYPE 2.00A RoHS:否 制造商:Bourns 電流額定值: 電阻:7.5 Ohms 最大直流電壓: 保持電流:0.1 A 安裝風(fēng)格:SMD/SMT 端接類型:SMD/SMT 跳閘電流:0.6 A 引線間隔: 系列:MF-PSHT 工作溫度范圍:- 40 C to + 125 C |
| 30ST350U | 功能描述:可復(fù)位保險絲 PTC 30V POLYFUSE STRAP TYPE 3.50A RoHS:否 制造商:Bourns 電流額定值: 電阻:7.5 Ohms 最大直流電壓: 保持電流:0.1 A 安裝風(fēng)格:SMD/SMT 端接類型:SMD/SMT 跳閘電流:0.6 A 引線間隔: 系列:MF-PSHT 工作溫度范圍:- 40 C to + 125 C |
發(fā)布緊急采購，3分鐘左右您將得到回復(fù)。