參數(shù)資料
型號(hào)： 2MHS360-789GG
廠(chǎng)商： ADVANCED INTERCONNECTIONS CORP
元件分類(lèi)： 插座
英文描述： BGA360, IC SOCKET
封裝： ROHS COMPLIANT
文件頁(yè)數(shù)： 2/2頁(yè)
文件大?。?/td> 727K
代理商： 2MHS360-789GG
Ball Grid Array (BGA) Adapters
For use with BGA Sockets on pages 8-9
5 Energy Way, West Warwick, RI 02893 USA
Tel: 800.424.9850 | 401.823.5200
Fax: 401.823.8723
info@advanced.com | www.advanced.com
Catalog 16A
Products shown covered by patents issued and/or pending. Specifications subject to change without notice.
inch/(mm)
Extraction Slot Adapter (AX)
Slots allow AIC extraction tool (sold separately) to easily
remove device/adapter assembly from socket
Mates with Extraction Socket (SB)
Adapter size equals BGA Device body + .157/(4.00)
Footprints:
Footprint specific insulators
drilled to exact device pattern.
Over 1000 footprints available -
see page 88, search online or
submit your device specs.
Use our Build-A-Part feature or
search in our online BGA Socket
FinderTM at www.bgasockets.com.
.906 Sq.
(23.00)
.039/(1.00) Typ.
360 Pins
Footprint Number 360-2
22 x 22 rows
Available Online:
RoHS Qualification Test Report
Technical articles
Test data
Signal Integrity Performance
CAD Drawings
BGA Footprints
BGA Adapters
.009
(0.23)Dia.
.146
(3.71)
2X
.011/(0.28)
Dia.
.218
(5.54)
2X
.018/(0.44)
Dia.
.342
(8.69)
.062
(1.57)
Standard Terminals
Type -638
Type -715
Type -700
.018
(0.46) Dia.
.182
(4.62)
.062
(1.57)
2X
.009/(0.23)
Dia.
.230
(5.84)
.010/(0.25)
Dia.
.159
(4.04)
Type -721
Type -735
Type -732
Additional standard and custom terminals available.
See Terminals section or consult factory.
0.80mm pitch
1.00mm pitch
1.27mm pitch
Dimensional Information
BGA Body + .079/(2.0)
BGA Device
.039/(1.0)
Standard Adapter (A)
How It Works
BGA Device
BGA Body + .157/(4.0)
.079/(2.0)
Mates with Standard Socket (S)
Adapter size equals BGA Device body + .079/(2.00)
.024/(0.61) Dia.
Solder Ball
.010/(0.25)
Dia.
.159
(4.04)
.018/(0.46)
Dia.
.182
(4.62)
.030/(0.76) Dia.
Solder Ball
.062
(1.57)
.020/(0.51) Dia.
Solder Ball
.009/(0.23)
Dia.
.146
(3.71)
Tin/Lead: Type -720
Lead-free: Type -823
Tin/Lead: Type -737
Lead-free: Type -824
Tin/Lead: Type -736
Lead-free: Type -829
S
tandard
Male
to
Male
SMT
(Surface
Mount)
0.80mm pitch
1.00mm pitch
1.27mm pitch
0.80mm pitch
1.00mm pitch
1.27mm pitch
Reflow (solder) BGA
Device to Adapter
Reflow (solder)
Socket to PCB
(See pgs. 8-9
for sockets)
Either Tin/Lead or Lead-free
device packages can be
attached to our RoHS
Compliant Adapters.
PC boards can be processed
with Tin/Lead BGA sockets in
standard profiles or lead-free
BGA sockets in RoHS
Compliant, high temperature
profiles.
See page 15 for Generic Reflow Profiles.
相關(guān)PDF資料
PDF描述
2RGSB360-636GG BGA360, IC SOCKET
2MV-10 MODULAR TERMINAL BLOCK
2MV-08 MODULAR TERMINAL BLOCK
2MV-06 MODULAR TERMINAL BLOCK
2MV-05 MODULAR TERMINAL BLOCK
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