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參數(shù)資料
| 型號(hào)： | 293D107X5010D2T |
| 廠商： | Vishay Intertechnology,Inc. |
| 英文描述： | Solid Tantalum Chip Capacitors TANTAMOUNT, Commercial, Surface Mount |
| 中文描述： | 固體鉭電容器芯片無(wú)異，商業(yè)，表面貼裝 |
| 文件頁(yè)數(shù)： | 12/13頁(yè) |
| 文件大?。?/td> | 160K |
| 代理商： | 293D107X5010D2T |
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www.vishay.com
26
293D
Vishay Sprague
Document Number 40002
Revision 27-Oct-04
For technical questions, contact tantalum@vishay.com
9.
Recommended Mounting Pad Geometries
: Proper mounting pad geometries are essential for successful solder
connections. These dimensions are highly process sensitive and should be designed to minimize component rework
due to unacceptable solder joints. The dimensional configurations shown are the recommended pad geometries for
both wave and reflow soldering techniques. These dimensions are intended to be a starting point for circuit board
designers and may be fine tuned if necessary based upon the peculiarities of the soldering process and/or circuit board
design.
Wave Solder Pads
Reflow Solder Pads
Pad Dimensions
B
(Nom.)
0.085
[2.15]
Case
Code
A
A
(Min.)
0.034
[0.87]
C
(Nom.)
0.053
[1.35]
D
(Nom.)
0.222
[5.65]
E
(Nom.)
0.048
[1.23]
0.061
[1.54]
0.061
[1.54]
0.066
[1.68]
0.066
[1.68]
0.034
[0.87]
0.085
[2.15]
0.106
[2.70]
0.106
[2.70]
0.106
[2.70]
0.085
[2.15]
0.065
[1.65]
0.124
[3.15]
0.175
[4.45]
0.175
[4.45]
0.053
[1.35]
0.234
[5.95]
0.337
[8.55]
0.388
[9.85]
0.388
[9.85]
0.222
[5.65]
0.048
[1.23]
0.050
[1.28]
0.050
[1.28]
0.050
[1.28]
0.048
[1.23]
B
C
D
E
P
A
(Min.)
0.071
[1.80]
B
(Nom.)
0.085
[2.15]
C
(Nom.)
0.053
[1.35]
D
(Nom.)
0.222
[5.65]
E
(Nom.)
0.048
[1.23]
0.110
[2.80]
0.110
[2.80]
0.118
[3.00]
0.118
[3.00]
0.071
[1.80]
0.085
[2.15]
0.106
[2.70]
0.106
[2.70]
0.106
[2.70]
0.085
[2.15]
0.065
[1.65]
0.124
[3.15]
0.175
[4.45]
0.175
[4.45]
0.053
[1.35]
0.234
[5.95]
0.337
[8.55]
0.388
[9.85]
0.388
[9.85]
0.222
[5.65]
0.048
[1.23]
0.050
[1.28]
0.050
[1.28]
0.050
[1.28]
0.048
[1.23]
D
A
C
B
E
Pad Dimensions
D
B
A
E
C
Case
Code
A
B
C
D
E
P
GUIDE TO APPLICATION
(Continued)
Recommended Solder Profile
—
Wave Solder
Recommended Solder Profile
—
Reflow
T
300
250
200
150
100
50
0
300
250
200
150
100
50
0
0 50 100 150 200 250
Time (Seconds)
245
°
C Typical
130
°
C Typical
Time (Seconds)
300
250
200
150
100
50
0
0 50 100 150 200 250
300
250
200
150
100
50
0
Max. Recommended
260
°
C
130
°
C
5 - 10 Sec.
T
SOLDERING PROFILE
RECOMMENDED MOUNTING PAD GEOMETRIES
in inches [millimeters]
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PDF描述 |
|---|---|
| 293D107X5010D2W | Solid Tantalum Chip Capacitors TANTAMOUNT, Commercial, Surface Mount |
| 293D107X9010D2T | Solid Tantalum Chip Capacitors TANTAMOUNT, Commercial, Surface Mount |
| 293D107X9010D2W | Solid Tantalum Chip Capacitors TANTAMOUNT, Commercial, Surface Mount |
| 293D107X0010D2T | Solid Tantalum Chip Capacitors TANTAMOUNT, Commercial, Surface Mount |
| 293D107X0010D2W | Solid Tantalum Chip Capacitors TANTAMOUNT, Commercial, Surface Mount |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| 293D107X5010D2TE3 | 功能描述:CAP TANT 100UF 10V 5% 2917 RoHS:是 類(lèi)別:電容器 >> 鉭 系列:TANTAMOUNT® 293D 標(biāo)準(zhǔn)包裝:1,000 系列:TANTAMOUNT® 695D 電容:3.3µF 電壓 - 額定:50V 容差:±20% ESR（等效串聯(lián)電阻）:3.2 歐姆 類(lèi)型:保形涂層 工作溫度:-55°C ~ 125°C 安裝類(lèi)型:表面貼裝 封裝/外殼:2414（6034 公制） 尺寸/尺寸:0.236" L x 0.135" W（6.00mm x 3.43mm） 高度 - 座高（最大）:0.085"（2.16mm） 引線間隔:- 制造商尺寸代碼:F 特點(diǎn):通用 包裝:帶卷 (TR) 壽命@溫度:- |
| 293D107X5010D2W | 制造商:VISHAY 制造商全稱:Vishay Siliconix 功能描述:Solid Tantalum Chip Capacitors TANTAMOUNT, Commercial, Surface Mount |
| 293D107X5010D2WE3 | 制造商:VISHAY 制造商全稱:Vishay Siliconix 功能描述:Solid Tantalum Surface Mount Chip Capacitors |
| 293D107X5010D8T | 制造商:VISHAY 制造商全稱:Vishay Siliconix 功能描述:Solid Tantalum Surface Mount Chip Capacitors |
| 293D107X5010D8W | 制造商:VISHAY 制造商全稱:Vishay Siliconix 功能描述:Solid Tantalum Surface Mount Chip Capacitors |
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