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參數資料
| 型號： | 293D107X0010D2W |
| 廠商： | Vishay Intertechnology,Inc. |
| 英文描述： | Solid Tantalum Chip Capacitors TANTAMOUNT, Commercial, Surface Mount |
| 中文描述： | 固體鉭電容器芯片無異，商業(yè)，表面貼裝 |
| 文件頁數： | 11/13頁 |
| 文件大小： | 160K |
| 代理商： | 293D107X0010D2W |
www.vishay.com
25
293D
Vishay Sprague
Document Number 40002
Revision 27-Oct-04
For technical questions, contact tantalum@vishay.com
5.
Power Dissipation
: Power dissipation will be
affected by the heat sinking capability of the mounting
surface. Non-sinusoidal ripple current may produce
heating effects which differ from those shown. It is
Temperature
Derating Factor
+ 25
°
C
+ 85
°
C
+ 125
°
C
1.0
0.9
0.4
1.
A-C Ripple Current:
The maximum allowable ripple
current shall be determined from the formula:
where,
P = Power Dissipation in Watts @ + 25
°
C as
given in the table in Paragraph Number 5 (Power
Dissipation).
I
rms
=
P
R
ESR
V
rms
= I
rms
x Z
P
R
ESR
V
rms
= Z
Case Code
Maximum Permissible
Power Dissipation
@ + 25
°
C (Watts)
in free air
A
B
C
D
E
P
0.075
0.085
0.110
0.150
0.165
0.025
R
ESR
= The capacitor Equivalent Series Resistance
at the specified frequency.
2.
A-C Ripple Voltage:
The maximum allowable ripple
voltage shall be determined from the formula:
or, from the formula:
where,
P = Power Dissipation in Watts @ + 25
°
C as
given in the table in Paragraph Number 5
(Power Dissipation).
R
ESR
= The capacitor Equivalent Series Resistance
at the specified frequency.
Z = The capacitor impedance at the specified
frequency.
2.1
The sum of the peak AC voltage plus the DC voltage
shall not exceed the DC voltage rating of the
capacitor.
2.2
The sum of the negative peak AC voltage plus the
applied DC voltage shall not allow a voltage reversal
exceeding 10% of the DC rating at + 25
°
C.
3.
Reverse Voltage:
These capacitors are capable of
withstanding peak voltages in the reverse direction
equal to 10% of the DC rating at + 25
°
C, 5% of the
DC rating at + 85
°
C and 1% of the DC rating at +125
°
C.
4.
Temperature Derating
: If these capacitors are to be
operated at temperatures above + 25
°
C, the
permissible rms ripple current or voltage shall be
calculated using the derating factors as shown:
6.
Printed Circuit Board Materials
: Type 293D
capacitors are compatible with commonly used printed
circuit board materials (alumina substrates, FR4,
FR5, G10, PTFE-fluorocarbon and porcelanized
steel).
7.
Attachment:
7.1
Solder Paste:
The recommended thickness of the
solder paste after application is .007"
±
.001"
[.178mm
±
.025mm]. Care should be exercised in
selecting the solder paste. The metal purity should
be as high as practical. The flux (in the paste) must
be active enough to remove the oxides formed on the
metallization prior to the exposure to soldering heat. In
practice this can be aided by extending the solder
preheat time at temperatures below the liquidous state
of the solder.
7.2
Soldering:
Capacitors can be attached by
conventional soldering techniques - vapor phase,
infrared reflow, wave soldering and hot plate methods.
The Soldering Profile chart shows maximum
recomended time/temperature conditions for solder-
ing. Attachment with a soldering iron is not recom-
mended due to the difficulty of controlling temperature
and time at temperature.
8.
Cleaning (Flux Removal) After Soldering:
The
293D is compatible with all commonly used solvents
such as TES, TMS, Prelete, Chlorethane, Terpene
and aqueous cleaning media. However, CFC/ODS
products are not used in the production of these
devices and are not recommended. Solvents contain-
ing methylene chloride or other epoxy solvents should
be avoided since these will attack the epoxy
encapsulation material.
When using ultrasonic cleaning, the board may
resonate if the output power is too high. This vibration
can cause cracking or a decrease in the adherence of
the termination. DO NOT EXCEED 9W/l @ 40kHz
for 2 minutes.
8.1
GUIDE TO APPLICATION
important that the equivalent
rms
value be established
when calculating permissible operating levels. (Power
Dissipation calculated using + 25
°
C temperature rise.)
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相關代理商/技術參數 |
參數描述 |
|---|---|
| 293D107X0010D2WE3 | 制造商:Vishay Sprague 功能描述:CAP 100UF 10VDC 20% 7.3 X 4.3 X 2.8MM SMD 7343-31 - Tape and Reel 制造商:Vishay Intertechnologies 功能描述:293D Series 100 uF 20 % 10 V Surface Mount Standard Molded Tantalum Capacitor 制造商:Vishay Intertechnologies 功能描述:Molded Tantalum Chip Capacitors |
| 293D107X0010D8T | 功能描述:鉭質電容器-固體SMD 100uF 10volts 20% D case Molded RoHS:否 制造商:AVX 電容:100 uF 電壓額定值:20 V ESR: 容差:10 % 外殼代碼 - in:2917 外殼代碼 - mm:7343 高度:4.1 mm 制造商庫存號:E Case 工作溫度范圍:- 55 C to + 125 C 系列:TBM 產品:Tantalum Solid Low ESR Commercial Grade 封裝:Bulk |
| 293D107X0010D8W | 制造商:VISHAY 制造商全稱:Vishay Siliconix 功能描述:Solid Tantalum Surface Mount Chip Capacitors |
| 293D107X0010E2WE3 | 制造商:VISHAY 制造商全稱:Vishay Siliconix 功能描述:Solid Tantalum Surface Mount Capacitors |
| 293D107X0010V2WE3 | 制造商:VISHAY 制造商全稱:Vishay Siliconix 功能描述:Solid Tantalum Surface Mount Capacitors |
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