參數(shù)資料
型號(hào)： 293D107X0010D2T
廠商： Vishay Intertechnology,Inc.
英文描述： Solid Tantalum Chip Capacitors TANTAMOUNT, Commercial, Surface Mount
中文描述： 固體鉭電容器芯片無(wú)異，商業(yè)，表面貼裝
文件頁(yè)數(shù)： 12/13頁(yè)
文件大小： 160K
代理商： 293D107X0010D2T
www.vishay.com
26
293D
Vishay Sprague
Document Number 40002
Revision 27-Oct-04
For technical questions, contact tantalum@vishay.com
9.
Recommended Mounting Pad Geometries
: Proper mounting pad geometries are essential for successful solder
connections. These dimensions are highly process sensitive and should be designed to minimize component rework
due to unacceptable solder joints. The dimensional configurations shown are the recommended pad geometries for
both wave and reflow soldering techniques. These dimensions are intended to be a starting point for circuit board
designers and may be fine tuned if necessary based upon the peculiarities of the soldering process and/or circuit board
design.
Wave Solder Pads
Reflow Solder Pads
Pad Dimensions
B
(Nom.)
0.085
[2.15]
Case
Code
A
A
(Min.)
0.034
[0.87]
C
(Nom.)
0.053
[1.35]
D
(Nom.)
0.222
[5.65]
E
(Nom.)
0.048
[1.23]
0.061
[1.54]
0.061
[1.54]
0.066
[1.68]
0.066
[1.68]
0.034
[0.87]
0.085
[2.15]
0.106
[2.70]
0.106
[2.70]
0.106
[2.70]
0.085
[2.15]
0.065
[1.65]
0.124
[3.15]
0.175
[4.45]
0.175
[4.45]
0.053
[1.35]
0.234
[5.95]
0.337
[8.55]
0.388
[9.85]
0.388
[9.85]
0.222
[5.65]
0.048
[1.23]
0.050
[1.28]
0.050
[1.28]
0.050
[1.28]
0.048
[1.23]
B
C
D
E
P
A
(Min.)
0.071
[1.80]
B
(Nom.)
0.085
[2.15]
C
(Nom.)
0.053
[1.35]
D
(Nom.)
0.222
[5.65]
E
(Nom.)
0.048
[1.23]
0.110
[2.80]
0.110
[2.80]
0.118
[3.00]
0.118
[3.00]
0.071
[1.80]
0.085
[2.15]
0.106
[2.70]
0.106
[2.70]
0.106
[2.70]
0.085
[2.15]
0.065
[1.65]
0.124
[3.15]
0.175
[4.45]
0.175
[4.45]
0.053
[1.35]
0.234
[5.95]
0.337
[8.55]
0.388
[9.85]
0.388
[9.85]
0.222
[5.65]
0.048
[1.23]
0.050
[1.28]
0.050
[1.28]
0.050
[1.28]
0.048
[1.23]
D
A
C
B
E
Pad Dimensions
D
B
A
E
C
Case
Code
A
B
C
D
E
P
GUIDE TO APPLICATION
(Continued)
Recommended Solder Profile
—
Wave Solder
Recommended Solder Profile
—
Reflow
T
300
250
200
150
100
50
0
300
250
200
150
100
50
0
0 50 100 150 200 250
Time (Seconds)
245
°
C Typical
130
°
C Typical
Time (Seconds)
300
250
200
150
100
50
0
0 50 100 150 200 250
300
250
200
150
100
50
0
Max. Recommended
260
°
C
130
°
C
5 - 10 Sec.
T
SOLDERING PROFILE
RECOMMENDED MOUNTING PAD GEOMETRIES
in inches [millimeters]
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