參數(shù)資料
型號(hào): 2920L030
廠商: Littelfuse, Inc.
英文描述: POLYFUSE㈢ Resettable PTCs Surface Mount
中文描述: POLYFUSE㈢復(fù)式膽道鏡表面貼裝
文件頁(yè)數(shù): 3/5頁(yè)
文件大小: 353K
代理商: 2920L030
www.littelfuse.com
2006 Littelfuse
POLYFUSE
Resettable PTCs
Surface Mount
2920L Series
Specifications are subject to change without notice.
Electronics Designers Guide
Environmental Specifications
Soldering Parameters
Condition
Reflow
Peak Temp/ Duration Time
260°C / 10 Sec
Time above liquids (TAL) 220°C
60 Sec ~ 100 Sec
Preheat 120°C~ 180°C
50 Sec ~ 150 Sec
0°C~35°C, <70%RH
Storage Condition
Recommended reflow methods: IR, vapor phase oven, hot air
oven, N
2
environment for lead-free
Devices are not designed to be wave soldered to the bottom side
of the board.
Recommended maximum paste thickness is 0.25mm (0.010 inch)
Devices can be cleaned using standard industry methods and
solvents.
Note:
f reflow temperatures exceed the recommended profile,
devices may not meet the performance requirements.
Operating/Storage
Temperature
-40°C to +85°C
Maximum Device Surface
Temperature in Tripped State
125°C
Passive Aging
+85°C, 1000 hours
±5% typical resistance change
Humidity Aging
+85°C, 85%R.H. 1000 hours
±5% typical resistance change
Thermal Shock
MIL-STD-202 Method 107G
+85°C/-40°C 20 times
-30% typical resistance change
Solvent Resistance
MIL-STD-202, Method 215
Vibration
MIL-STD-883C, Method
2007.1, Condition A
Physical Specifications
Terminal Material
Solder-Plated Copper (Solder Material:
Matte Tin(Sn))
Lead Solderability
Meets EIA Specification RS186-9E, ANSI/
J-STD-002 Category 3.
Preheating
120
180
220
260
0
60 to 100
T
Soldering
Cooling
120
50 to 150
Time(s)
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