參數(shù)資料
型號: 287MS8E
廠商: 美國訊泰微波有限公司上海代表處
英文描述: GaAs MMIC LOW NOISE AMPLIFIER with AGC, 2.3 - 2.5 GHz
中文描述: 砷化鎵MMIC低噪聲放大器,自動增益控制,2月3日至二月五日吉赫
文件頁數(shù): 4/6頁
文件大?。?/td> 294K
代理商: 287MS8E
8
A
8 - 25
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com
Outline Drawing
Absolute Maximum Ratings
Gain Control
NOTES:
1. LEADFRAME MATERIAL: COPPER ALLOY
2. DIMENSIONS ARE IN INCHES [MILLIMETERS]
3. DIMENSION DOES NOT INCLUDE MOLDFLASH OF 0.15mm PER SIDE.
4. DIMENSION DOES NOT INCLUDE MOLDFLASH OF 0.25mm PER SIDE.
5. ALL GROUND LEADS MUST BE SOLDERED TO PCB RF GROUND.
Drain Bias Voltage (Vdd)
+7.0 Vdc
Control Voltage Range (Vctl)
-0.2V to Vdd
RF Input Power (RFin)(Vdd = +3.0 Vdc)
-7 dBm
Channel Temperature
150 °C
Continuous Pdiss (T = 85 °C)
(derate 5.62 mW/°C above 85 °C)
0.365 W
Thermal Resistance
(channel to lead)
178 °C/W
Storage Temperature
-65 to +150 °C
Operating Temperature
-40 to +85 °C
Vctl (Vdc)
Gain State
Typical
Ictl (uA)
0.0
Maximum
25
1.5
Middle
25
Vdd
Minimum
25
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/"3%26%(!.$,).'02%#!54)/.3
HMC287MS8
/
287MS8E
GaAs MMIC LOW NOISE AMPLIFIER
with AGC, 2.3 - 2.5 GHz
v02.0605
Part Number
Package Body Material
Lead Finish
MSL Rating
Package Marking
[3]
HMC287MS8
Low Stress Injection Molded Plastic
Sn/Pb Solder
MSL1
[1]
H287
XXXX
HMC287MS8E
RoHS-compliant Low Stress Injection Molded Plastic
100% matte Sn
MSL1
[2]
H287
XXXX
[1] Max peak reflow temperature of 235 °C
[2] Max peak reflow temperature of 260 °C
[3] 4-Digit lot number XXXX
Package Information
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