- 您現(xiàn)在的位置：買賣IC網(wǎng) > PDF目錄371406 > 25LC010A (Microchip Technology Inc.) 1K SPI Bus Serial EEPROM PDF資料下載
參數(shù)資料
| 型號： | 25LC010A |
| 廠商： | Microchip Technology Inc. |
| 英文描述： | 1K SPI Bus Serial EEPROM |
| 中文描述： | 每1000 SPI總線串行EEPROM |
| 文件頁數(shù)： | 19/28頁 |
| 文件大?。?/td> | 362K |
| 代理商： | 25LC010A |
第1頁第2頁第3頁第4頁第5頁第6頁第7頁第8頁第9頁第10頁第11頁第12頁第13頁第14頁第15頁第16頁第17頁第18頁當前第19頁第20頁第21頁第22頁第23頁第24頁第25頁第26頁第27頁第28頁
2006 Microchip Technology Inc.
Preliminary
DS21832C-page 19
25AA010A/25LC010A
8-Lead Plastic Micro Small Outline Package (MS) (MSOP)
D
A
A1
L
c
α
A2
E1
E
p
B
n
1
2
φ
β
F
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" (0.254mm) per side.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
See ASME Y14.5M
.037 REF
F
φ
Footprint (Reference)
Foot Angle
Lead Thickness
Notes:
Revised 07-21-05
*
Controlling Parameter
Mold Draft Angle Top
Mold Draft Angle Bottom
Lead Width
β
α
c
B
.003
.009
.006
.012
Dimension Limits
Overall Height
Molded Package Thickness
Standoff
Overall Width
Molded Package Width
Overall Length
Foot Length
Number of Pins
Pitch
A
L
E1
D
A1
E
A2
.016
.024
.118 BSC
.118 BSC
.000
.030
.193 BSC
.033
MIN
p
n
Units
.026 BSC
NOM
8
INCHES
0.95 REF
-
-
-
-
.009
.016
15°
0.08
0.22
0°
0.23
0.40
15°
15°
8°
MILLIMETERS
*
NOM
0.65 BSC
0.85
3.00 BSC
3.00 BSC
0.60
4.90 BSC
.043
.037
.006
.031
0.40
0.00
0.75
MIN
MAX
1.10
0.95
0.80
0.15
MAX
8
-
-
-
5°
5°
JEDEC Equivalent: MO-187
Drawing No. C04-111
0°
-
8°
5°
5°
-
-
15°
-
-
-
-
REF: Reference Dimension, usually without tolerance, for information purposes only.
See ASME Y14.5M
相關PDF資料 |
PDF描述 |
|---|---|
| 25AA020A | 2K SPI Bus Serial EEPROM |
| 25AA040A | 4K SPI Bus Serial EEPROM |
| 25AA080 | 8K/16K 1.8V SPI Bus Serial EEPROM |
| 25AA160 | 8K/16K 1.8V SPI Bus Serial EEPROM |
| 25AA1024 | 1 Mbit SPI Bus Serial EEPROM |
相關代理商/技術參數(shù) |
參數(shù)描述 |
|---|---|
| 25LC010A/S16K | 制造商:Microchip Technology Inc 功能描述:1K, 128 X 8, 2.5V SER EE, DIE - Gel-pak, waffle pack, wafer, diced wafer on film |
| 25LC010A/W16K | 制造商:Microchip Technology Inc 功能描述:1K, 128 X 8, 2.5V SER EE, WAFER - Gel-pak, waffle pack, wafer, diced wafer on film |
| 25LC010A/WF16K | 制造商:Microchip Technology Inc 功能描述:1K, 128 X 8, 2.5V SER EE, WAF - Gel-pak, waffle pack, wafer, diced wafer on film |
| 25LC010A_09 | 制造商:MICROCHIP 制造商全稱:Microchip Technology 功能描述:1K-4K SPI Serial EEPROM High Temp Family Data Sheet |
| 25LC010A-E/MC | 制造商:MICROCHIP 制造商全稱:Microchip Technology 功能描述:1K SPI Bus Serial EEPROM |
發(fā)布緊急采購，3分鐘左右您將得到回復。