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參數(shù)資料
| 型號(hào)： | 2367-5001-54 |
| 英文描述： | SSMT Next Generation Surface Mount |
| 中文描述： | SSMT新一代表面貼裝 |
| 文件頁(yè)數(shù)： | 10/12頁(yè) |
| 文件大小： | 200K |
| 代理商： | 2367-5001-54 |
M/A-COM, Inc.
North America:
Tel. (800) 366-2266
Fax (800) 618-8883
I
Asia/Pacific: Tel.
+85 2 2375 0618
+85 2 2375 0350
I
Europe: Tel. +44 (1344) 869 595
Fax +44 (1344) 300 020
Fax
10
Specifications Subject to Change Without Notice.
Soldering cont’d.
Post-Solder Cleaning
TEMP
°
C
250
200
150
100
50
10 - 30 MIN
AT
80 - 130
°
C
PREHEAT
30 - 180 SEC
AT 110 - 150
°
C
AMBIENT
OR
FORCED
COOL DOWN
REFLOW
20 - 90 SEC
AT 215
°
C
Figure 5
Typical Vapor Phase Heating/Soldering Profile
A 15-40 watt max. fine point tip soldering iron is recommended for
manual soldering. Soldering iron tip temperature should not exceed
350-370°C. Lengthy application of heat and/or direct contact of the
iron tip with the plastic housing should be avoided. The flux core solder
(i.e.; 63/37 RMA, 62/36/2 RMA) is recommended. The center
contact pad reflows easiest because of relatively low thermal mass,
therefore, the center contact lead should be soldered first to minimize
connector ”skating“.
OSMT plug receptacles can withstand most electronics grade
cleaning agents including: high temperature water/aqueous cleaners,
ethanol, methanol, MEK, acetone, 1,1,1-tricloroethane, trichlordethyl-
ene, perchloroethylene, chlorofloro-carbon (CFC) solvents,
isopropanol, dichlorofluoroethane, and blends. The OSMT cable jacket
can also withstand mild exposure to the above listed cleaning agents.
OSMT
Application Notes
Decimal inch equivalents are shown in parentheses for general information only.
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