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參數(shù)資料
| 型號： | 21085 |
| 英文描述： | AMD-K6 Processor I/O Model Application Note AMD-K6 Processor Thermal Solution Design Application Note |
| 中文描述： | 的AMD - K6處理器的I / O模型的應(yīng)用指南的AMD - K6處理器散熱解決方案設(shè)計(jì)中的應(yīng)用說明 |
| 文件頁數(shù)： | 10/22頁 |
| 文件大?。?/td> | 335K |
| 代理商： | 21085 |
2
Introduction
AMD-K6
Processor Thermal Solution Design
21085I/0—February 1999
An effective thermal management system is the best way to
maintain the case temperature within specification. In addition
to the thermal characteristics and power dissipation of the
processor, the temperature of the processor case is dependent
on internal ambient temperature and air velocity. The internal
ambient temperature is affected by several variables—
electronic components, peripherals, thermal characteristics of
the chassis, and external ambient temperature.
Thermal management consists of heatsinks, thermal interface
materials, heatsink clips, fans, chassis ventilation, and
component placement. This application note is intended to
guide the system designer through the process of developing an
effective thermal solution for the AMD-K6 processor.
For information about the thermal specifications for the
following AMD-K6 processors:
AMD-K6 processor Model 6 (0.35-
μ
m process technology)
and the AMD-K6 processor Model 7 (0.25-
μ
m process
technology), refer to the
AMD-K6
Processor Data Sheet
,
order# 20695.
AMD-K6-2 processor Model 8 (0.25-
μ
m process technology),
refer to the
AMD-K6
-2
Processor Data Sheet
, order# 21850.
AMD-K6-III processor Model 9 (0.25-
μ
m process technology),
refer to the
AMD-K6
-III Processor Data Sheet,
order# 21918
.
I
I
I
System Conditions
The environmental specifications on most systems guarantee
operation for external ambients up to 35°C. Most PC
chassis/system boxes result in an internal 10°C increase in
temperature over the external ambient temperature. In
general, this means the thermal solution should be designed to
allow an internal ambient (T
A
) of 45°C.
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