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參數(shù)資料
| 型號： | 1PMT5920B |
| 廠商： | ON SEMICONDUCTOR |
| 英文描述： | 3.2 Watt Plastic Surface Mount POWERMITE Package |
| 中文描述： | 3.2瓦特塑料表面貼裝POWERMITE包 |
| 文件頁數(shù)： | 5/8頁 |
| 文件大?。?/td> | 62K |
| 代理商： | 1PMT5920B |
1PMT5920B Series
http://onsemi.com
5
TYPICAL SOLDER HEATING PROFILE
For any given circuit board, there will be a group of
control settings that will give the desired heat pattern. The
operator must set temperatures for several heating zones
and a figure for belt speed. Taken together, these control
settings make up a heating “profile” for that particular
circuit board. On machines controlled by a computer, the
computer remembers these profiles from one operating
session to the next. Figure 9 shows a typical heating profile
for use when soldering a surface mount device to a printed
circuit board. This profile will vary among soldering
systems, but it is a good starting point. Factors that can
affect the profile include the type of soldering system in
use, density and types of components on the board, type of
solder used, and the type of board or substrate material
being used. This profile shows temperature versus time.
The line on the graph shows the actual temperature that
might be experienced on the surface of a test board at or
near a central solder joint. The two profiles are based on a
high density and a low density board. The Vitronics
SMD310 convection/infrared reflow soldering system was
used to generate this profile. The type of solder used was
62/36/2 Tin Lead Silver with a melting point between
177189
°
C. When this type of furnace is used for solder
reflow work, the circuit boards and solder joints tend to
heat first. The components on the board are then heated by
conduction. The circuit board, because it has a large surface
area, absorbs the thermal energy more efficiently, then
distributes this energy to the components. Because of this
effect, the main body of a component may be up to 30
degrees cooler than the adjacent solder joints.
STEP 1
PREHEAT
ZONE 1
RAMP"
STEP 2
VENT
SOAK"
STEP 3
HEATING
ZONES 2 & 5
RAMP"
STEP 4
HEATING
ZONES 3 & 6
SOAK"
STEP 5
HEATING
ZONES 4 & 7
SPIKE"
STEP 6
VENT
STEP 7
COOLING
200
°
C
150
°
C
100
°
C
50
°
C
TIME (3 TO 7 MINUTES TOTAL)
T
MAX
SOLDER IS LIQUID FOR
40 TO 80 SECONDS
(DEPENDING ON
MASS OF ASSEMBLY)
205
°
TO 219
°
C
PEAK AT
SOLDER JOINT
DESIRED CURVE FOR LOW
MASS ASSEMBLIES
100
°
C
150
°
C
160
°
C
170
°
C
140
°
C
Figure 9. Typical Solder Heating Profile
DESIRED CURVE FOR HIGH
MASS ASSEMBLIES
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相關代理商/技術參數(shù) |
參數(shù)描述 |
|---|---|
| 1PMT5920B/D | 制造商:ONSEMI 制造商全稱:ON Semiconductor 功能描述:3.2 Watt Plastic Surface Mount POWERMITE? Package |
| 1PMT5920B/TR13 | 制造商:Microsemi Corporation 功能描述:3.0W, VZ = 6.2V, ? 5% - Tape and Reel 制造商:Microsemi Corporation 功能描述:DIODE ZENER 3W 6.2V 5% POWERMITE |
| 1PMT5920B/TR7 | 制造商:Microsemi Corporation 功能描述:3.0W, VZ = 6.2V, ? 5% - Tape and Reel 制造商:Microsemi Corporation 功能描述:DIODE ZENER 3W 6.2V 5% POWERMITE |
| 1PMT5920B＼D | 制造商:ONSEMI 制造商全稱:ON Semiconductor 功能描述:3.2 Watt Plastic Surface Mount POWERMITE? Package |
| 1PMT5920B_05 | 制造商:ONSEMI 制造商全稱:ON Semiconductor 功能描述:3.2 Watt Plastic Surface Mount POWERMITE Package |
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