參數(shù)資料
型號: 1N5820RLG
廠商: ON SEMICONDUCTOR
元件分類: 參考電壓二極管
英文描述: Axial Lead Rectifiers
中文描述: 3 A, 20 V, SILICON, RECTIFIER DIODE, DO-201AD
封裝: LEAD FREE, PLASTIC, CASE 267-05, 2 PIN
文件頁數(shù): 6/8頁
文件大?。?/td> 103K
代理商: 1N5820RLG
1N5820, 1N5821, 1N5822
http://onsemi.com
6
3.0
0.1
I
F(AV)
, AVERAGE FORWARD CURRENT (AMP)
Figure 6. Forward Power Dissipation 1N582022
10
7.0
5.0
0.7
0.5
0.1
5.0
P
0.2
0.3
0.5
2.0
,
F
3.0
2.0
1.0
0.3
0.2
0.7 1.0
7.0 10
dc
SQUARE WAVE
T
J
125
°
C
SINE WAVE
I(FM)
I(AV)
(ResistiveLoad)
Capacitive
Loads
5.0
10
20
T
A(A)
T
A(K)
T
L(A)
T
C(A)
T
J
T
C(K)
T
L(K)
P
D
R
S(A)
R
L(A)
R
J(A)
R
J(K
)
R
L(K)
R
S(K)
NOTE 4 APPROXIMATE THERMAL CIRCUIT MODEL
Use of the above model permits junction to lead thermal
resistance for any mounting configuration to be found. For
a given total lead length, lowest values occur when one side
of the rectifier is brought as close as possible to the heat sink.
Terms in the model signify:
T
A
= Ambient Temperature
T
L
= Lead Temperature
R
S
= Thermal Resistance, Heatsink to Ambient
R
L
= Thermal Resistance, LeadtoHeatsink
R
J
= Thermal Resistance, JunctiontoCase
P
D
= Total Power Dissipation = P
F
+ P
R
P
F
= Forward Power Dissipation
P
R
= Reverse Power Dissipation
(Subscripts (A) and (K) refer to anode and cathode sides,
respectively.) Values for thermal resistance components
are:
R
L
= 42
°
C/W/in typically and 48
°
C/W/in maximum
R
J
= 10
°
C/W typically and 16
°
C/W maximum
The maximum lead temperature may be found as follows:
T
L
= T
J(max)
T
JL
where
T
JL
R
JL
· P
D
T
C
= Case Temperature
T
J
= Junction Temperature
TYPICAL VALUES FOR
R
JA
IN STILL AIR
Data shown for thermal resistance junctiontoambient (R
JA
)
for the mountings shown is to be used as typical guideline values
for preliminary engineering, or in case the tie point temperature
cannot be measured.
1
2
3
Mounting
Method
Lead Length, L (in)
1/8
1/4
1/2
3/4
R
JA
50
51
53
55
°
C/W
°
C/W
°
C/W
58
59
61
63
28
NOTE 5 — MOUNTING DATA
Mounting Method 1
P.C. Board where available
copper surface is small.
Mounting Method 3
P.C. Board with
21/2, x 21/2,
copper surface.
BOARD GROUND
PLANE
VECTOR PUSHIN
TERMINALS T28
Mounting Method 2
ééééééé
ééééééé
L
L
éééééééé
éééééééé
é
é
é
é
é
L = 1/2
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