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參數(shù)資料
| 型號(hào)： | 1N5811D3B.CVB |
| 廠商： | SEMELAB LTD |
| 元件分類： | 整流器 |
| 英文描述： | 3 A, 150 V, SILICON, RECTIFIER DIODE |
| 封裝： | HERMETIC SEALED, CERAMIC, DLCC3 VARIANT B, 2 PIN |
| 文件頁數(shù)： | 3/4頁 |
| 文件大?。?/td> | 291K |
| 代理商： | 1N5811D3B.CVB |
ULTRA FAST RECOVERY
POWER RECTIFIER
1N5811D3A / 1N5811D3B
Semelab plc
Coventry Road, Lutterworth, Leicestershire, LE17 4JB
Document Number 8613
Telephone +44 (0) 1455 556565
Fax +44 (0) 1455 552612
Issue 2
Email: sales@semelab-tt.com
Website: http://www.semelab-tt.com
Page 3 of 4
MECHANICAL DATA
A
D
C
B
1
2
SML
D3A
A
D
C
B
1
2
3
SML
D3B
* The additional contact provides a connection to the lid in the application. Connecting the metal lid to a known electrical potential stops deep
dielectric discharge in space applications; see the Space Weather link www.semelab.co.uk/dlcc3.html on the Semelab web site. Package variant
to be specified at order.
The DLCC3 package design takes full advantage of the proven high reliability pedigree of the HTCC surface mount packaging technology,
which is easily integrated for automated assembly. Semelab has taken the existing standards for ceramic surface mount package manufacture
and added additional design features to enhance thermal performance, to present a competitive alternative for high reliability applications.
SOLDER PAD LAYOUT
)
*
+
Soldering temperature should be 260°C for a
maximum of 10 seconds.
The physical dimensions for the DLCC3 ceramic package are designed
to be different from the published dimensions for the “D-5B” and “E-
MELF” outlines.
The DLCC3 design fully utilises the recommended
solder footprint for the “D-5B” / “E-MELF” Package, and as such
presents a drop in replacement for existing board designs.
PACKAGE MASS
Gold Plated Solder Pad Finish = 150mg
mm
Inches
A
7.32
0.288
B
1.78
0.070
C
3.94
0.155
DLCC3 Variant B (D3B)
PAD 1
ANODE
PAD 2
CATHODE
PAD 3
LID CONTACT TO CATHODE*
DIMENSION
mm
Inches
A
7.00 ±0.10
0.275 ±0.004
B
3.75 ±0.10
0.143 ±0.004
C
1.60 ±0.10
0.063 ±0.004
D
1.76 ±0.10
0.069 ±0.004
DLCC3 Variant A (D3A)
PAD 1
ANODE
PAD 2
CATHODE
DIMENSION
mm
Inches
A
7.00 ±0.10
0.275 ±0.004
B
3.75 ±0.10
0.143 ±0.004
C
1.60 ±0.10
0.063 ±0.004
D
1.76 ±0.10
0.069 ±0.004
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| 1N5811US | 3 A, SILICON, RECTIFIER DIODE |
| 1N5813 | 20 A, SILICON, RECTIFIER DIODE |
| 1N5817TR | 1 A, 20 V, SILICON, SIGNAL DIODE, DO-41 |
| 1N5817 | 1 A, 20 V, SILICON, SIGNAL DIODE |
| 1N5817 | 1 A, 20 V, SILICON, SIGNAL DIODE, DO-41 |
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| 1N5811E3 | 制造商:Microsemi Corporation 功能描述:1N5811E3 - Bulk |
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| 1N5811JANTXV | 制造商:SNSTRN 功能描述: |
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| 1N5811U | 制造商:STMICROELECTRONICS 制造商全稱:STMicroelectronics 功能描述:Aerospace 6 A fast recovery rectifier |
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