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    參數(shù)資料
    型號: 1KS056-176GT
    廠商: ADVANCED INTERCONNECTIONS CORP
    元件分類: 插座
    英文描述: PGA56, IC SOCKET
    文件頁數(shù): 1/2頁
    文件大?。?/td> 174K
    代理商: 1KS056-176GT
    5 Energy Way, P.O. Box 1019, West Warwick, RI 02893 USA Tel. 800-424-9850/401-823-5200 Fax 401-823-8723 Email info@advintcorp.com Internet http://www.advintcorp.com
    Polyimide Film
    .005
    (.13)
    RTV Sealed
    Tape Sealed
    RTV
    Seal
    To order: Add 3M to end of part #
    To order: Add RTV to end of part #
    Note: RTV not available with HCS or HCIS Insulators
    Low Insertion Force
    Peel-A-Way
    PGA Sockets
    Features
    :
    Disposable carriers peel away after
    soldering.
    Peel-A-Way tabs and full grid wafer
    supplied on all Peel-A-Way PGA sockets.
    Maximum air flow under PGA for greater
    cooling.
    Better flux rinse and cleaning.
    Allows inspection of solder joints on both
    sides of PCB.
    Lowest profile with use of type -210
    terminal.
    Peel-A-Way disposable socket terminal
    carrier available in any configuration shown
    or custom designed to meet your
    specifications.
    Terminals and Contacts:
    Terminal: Brass - Copper Alloy (C36000)
    ASTM-B-16
    Contact: Beryllium Copper (C17200)
    ASTM-B-194
    Solder Preform:
    63% Tin, 37% Lead
    Plating:
    Terminal: Gold over Nickel or
    Tin-Lead over Nickel
    Contact: Gold over Nickel or
    Tin-Lead over Nickel
    Gold per MIL-G-45204
    Tin-Lead per MIL-P-81728
    Nickel per QQ-N-290
    Body Material:
    KS/KIS - Polyimide Film
    -269C to 400C (-452F to 752F)
    Peel-A-Way
    Low Insertion Force PGA Sockets
    How To Order
    1
    KS
    068
    -85
    T
    G
    Footprint Dash #
    If Applicable*
    Terminal Plating
    G - Gold
    T - Tin-Lead
    Contact Plating
    G - Gold
    T - Tin-Lead
    Terminal Type
    See next page
    for terminal types
    Body Type
    KS - 2.5 oz.(70.85 g) avg. insertion force
    KIS - 1 oz.(28.34 g) avg. insertion force
    Number of Pins
    004 to 484
    *See pages 37 - 64
    for PGA footprints
    Polyimide Film
    Peel away
    after soldering
    to PCB.
    PCB
    Solder fillets visible both sides
    for inspection and cleaning.
    Sealant Options
    Peel-A-Way covered by patent rights issued and/or pending.
    How To Use:
    1. Place socket in PCB.
    2. Send PCB and socket through soldering operation.
    3. Peel away polyimide film carrier.
    inch/(mm
    )
    Products shown covered by patents issued and/or pending. Specifications subject to change without notice.
    Page 34
    相關PDF資料
    PDF描述
    1KS056-176TT PGA56, IC SOCKET
    1KS056-210GG PGA56, IC SOCKET
    1KS056-33GG PGA56, IC SOCKET
    1KS056-33TG PGA56, IC SOCKET
    1KS056-33TT PGA56, IC SOCKET
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