參數(shù)資料
型號(hào): 1827928-1
廠商: Tyco Electronics
元件分類: 電路板相疊連接器
英文描述: Battery Interconnection System
中文描述: 電池互連系統(tǒng)
文件頁數(shù): 79/116頁
文件大?。?/td> 7905K
代理商: 1827928-1
MID
Products for Mobile Equipment
MID Technology
Catalog 1654270-2
Revised 8-2007
All specifications subject to change. Consult Tyco Electronics for latest specifications.
63
MID Technology
at Tyco Electronics
Tyco Electronics prides itself
in being the global leader in
providing Molded Interconnect
Technology (MID). In it’s most
basic form, MID technology
can be defined as any product
that results in selectively plated
plastic parts. This technology
can be used in three basic
ways, to solve 3-dimensional
electro-mechanical problems,
for shielding purposes, or to
develop antennas.
MID Technologies
Tyco Electronics can manu-
facture MID parts using three
manufacturing technologies,
Two Shot, Laser Imaging, and
Laser Direct Structuring.
Two Shot MID Technology
Two Shot
Sequential injection molded substrate
A plateable resin and a non-plateable resin
Imaging in the molding process
All electroless plating of catalyzed surfaces
Laser Imaging MID Technology
Laser Imaging today is typically only used for rapid prototyping
Manufacturing using a circuit board production type process
Machine or single shot mold in 3–10 days
Laser image circuitry in 3–5 days
Circuitry and plating are accurate to production processes
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