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參數(shù)資料
| 型號(hào)： | 16TTS12STRL |
| 廠商： | International Rectifier |
| 英文描述： | SURFACE MOUNTABLE PHASE CONTROL SCR |
| 中文描述： | 表面貼裝相位控制可控硅 |
| 文件頁(yè)數(shù)： | 3/8頁(yè) |
| 文件大?。?/td> | 119K |
| 代理商： | 16TTS12STRL |
3
16TTS.. S
SAFE
IR
Series
Bulletin I2105 rev. D 12/98
www.irf.com
Triggering
P
GM
P
G(AV)
Max. average Gate Power
Max. peak Gate Power
8.0
W
2.0
+ I
GM
Max. paek positive Gate Current
1.5
A
- V
GM
Max. paek negative Gate Voltage
10
V
I
GT
Max. required DC Gate Current
90
mA
Anode supply = 6V, resistive load, T
J
= - 10°C
to trigger
60
Anode supply = 6V, resistive load, T
J
= 25°C
35
Anode supply = 6V, resistive load, T
J
= 125°C
V
GT
Max. required DC Gate Voltage
3.0
V
Anode supply = 6V, resistive load, T
J
= - 10°C
to trigger
2.0
Anode supply = 6V, resistive load, T
J
= 25°C
1.0
Anode supply = 6V, resistive load, T
J
= 125°C
V
GD
I
GD
Max. DC Gate Voltage not to trigger
0.25
T
J
= 125°C, V
DRM
= rated value
T
J
= 125°C, V
DRM
= rated value
Max. DC Gate Current not to trigger
2.0
mA
Parameters
16TTS..S
Units
Conditions
Switching
Parameters
16TTS..S
Units
Conditions
t
gt
t
rr
t
q
Typical turn-on time
0.9
μs
T
J
= 25°C
Typical reverse recovery time
4
T
J
= 125°C
Typical turn-off time
110
T
J
T
stg
Max. Junction Temperature Range
Max. Storage Temperature Range
- 40 to 125
- 40 to 125
°C
°C
Soldering Temperature
240
°C
for 10 seconds (1.6mm from case)
R
thJC
Max. Thermal Resistance Junction
to Case
R
thJA
Typ. Thermal Resistance Junction
to Ambient (PCB Mount)**
wt
Approximate Weight
1.3
°C/W
DC operation
40
°C/W
2 (0.07)
g (oz.)
T
Case Style
D
2
Pak (SMD-220)
Thermal-Mechanical Specifications
Parameters
16TTS..S Units
Conditions
**When mounted on 1" square (650mm
2
) PCB of FR-4 or G-10 material 4 oz (140μm) copper 40°C/W
For recommended footprint and soldering techniques refer to application note #AN-994
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