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參數(shù)資料
| 型號： | 1640240-3 |
| 廠商： | Tyco Electronics |
| 元件分類： | 終端 |
| 英文描述： | Matrix Series Ball Grid Array (BGA) Sockets |
| 中文描述： | Matrix Series Ball Grid Array (BGA) Sockets |
| 文件頁數(shù)： | 2/5頁 |
| 文件大?。?/td> | 3796K |
| 代理商： | 1640240-3 |
Matrix Series BGA Sockets
2
Compression Force: 45 grams/contact nominal
Durability:
20 cycles dependent on application
ELECTRICAL
MECHANICAL
Current Capability:
4 amps per column max
Contact Resistance: 50 milliohms max
Insulation Resistance: 1000 megohms at 100 VDC
Inductance: Self .4nH, Mutual .2nH
Capacitance: .1pF
ENVIRONMENTAL
Operating Temperature: 0°C to 90°C
Close up of corner frame and
HXC Polymer contacts
The HXC 125 socket provides a compression mount solderless interconnect. Ahardware system is required to generate
the necessary forces. Tyco Electronics offers a complete hardware solution for each socket size. Each hardware kit
contains enough hardware for one socket - a spring plate, a top plate, a bolster plate with insulator.
Polyimide
Carrier
Well
BGABall
HXC 125
Polymer
Contact
BGA
Package
FullArray
Stop
Contact to Solder Ball Interface
Spring
Plate
System shown fully compressed
Side view fully compressed
PC Board
HXC 125
Polymer Socket
Top Support
Plate
Actuation
Screw
Bolster
Plate
BGA
Device
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| 1640240-4 | Matrix Series Ball Grid Array (BGA) Sockets |
| 1640240-6 | Matrix Series Ball Grid Array (BGA) Sockets |
| 1640240-7 | Matrix Series Ball Grid Array (BGA) Sockets |
| 1640240-8 | Matrix Series Ball Grid Array (BGA) Sockets |
| 1640240-9 | Matrix Series Ball Grid Array (BGA) Sockets |
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