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| 型號(hào)： | 1626 |
| 元件分類： | 復(fù)位半導(dǎo)體 |
| 英文描述： | 300mA LDO Linear Regulators with Internal Microprocessor Reset Circuit |
| 中文描述： | 膠凝膠的3G管 |
| 文件頁(yè)數(shù)： | 5/6頁(yè) |
| 文件大?。?/td> | 62K |
| 代理商： | 1626 |
Technical Data Sheet
Product 454
Worldwide Version, February 1996
NOT FOR PRODUCT SPECIFICATIONS.
THE TECHNICAL DATA CONTAINED HEREIN ARE INTENDED AS REFERENCE ONLY.
PLEASE CONTACT LOCTITE CORPORATION QUALITY DEPARTMENT FOR ASSISTANCE AND RECOMMENDATIONS ON SPECIFICATIONS FOR THIS PRODUCT.
ROCKY HILL, CT
FAX: +1 (860)-571-5473
DUBLIN, IRELAND
FAX: +353-(1)-451 - 9959
PRODUCT DESCRIPTION
LOCTITE Product 454 is fast curing, single component gel
cyanoacrylate adhesive. It is specifically formulated for difficult
to bond substrates.
The gel consistency prevents adhesive
flow even on vertical surfaces.
TYPICAL APPLICATIONS
Rapid bonding of a wide range of metal, plastic or elastomeric
materials, particularly suited for bonding porous or absorbent
materials such as wood, paper, leather or fabric.
PROPERTIES OF UNCURED MATERIAL
Typical
Value
Range
Chemical Type
Ethyl cyanoacrylate
Appearance
Clear, translucent
Specific Gravity @ 25
°C
1.1
Viscosity @ 25
°C, mPa.s (cP)
Gel
Flash Point (TCC),
°C
>80
TYPICAL CURING PERFORMANCE
Under normal conditions, the surface moisture initiates the
hardening process.
Although full functional strength is
developed in a relatively
short time, curing continues for at
least 24 hours before full chemical/solvent resistance is
developed.
Cure speed vs. substrate
The
rate of cure will depend on substrate used.
The table
below shows the fixture time achieved on different materials at
22
°C, 50% relative humidity.
This is defined as the time to
develop a shear strength of 0.1 N/mm (14.5 psi) tested
according to ASTM D1002.
Substrate
Fixture Time, seconds
Steel (degreased)
5 to 20
Aluminium
2 to 10
Zinc dichromate
10 to 20
Neoprene
<5
Nitrile rubber
<5
ABS
2 to 10
PVC
2 to 10
Polycarbonate
10 to 40
Phenolic materials
2 to 10
Cure speed vs. bond gap
The rate of cure will depend on the bondline gap. High cure
speed is favoured by thin bond lines. Increasing the bond gap
will slow down the rate of cure.
Cure speed vs. humidity
The rate of cure will depend on the ambient relative humidity.
The following graph shows the tensile strength developed with
time on Buna N rubber at different levels of humidity.
0
10
20
30
40
50
60
0
25
50
75
100
Cure Time, seconds
%
of
Fu
ll
St
re
ng
th
20%RH
60%R H
40%RH
Cure speed vs. activator
Where cure speed is unacceptably long due to large gaps or
low relative humidity applying activator to the surface will
improve cure speed. However , this can reduce the ultimate
strength of the bond, therefore testing is recommended to
confirm effect
.
TYPICAL PROPERTIES OF CURED MATERIAL
Physical Properties
Coefficient of thermal expansion, ASTM D696, K-1
80 x 10-6
Coefficient of thermal conductivity, ASTM C177, W.m-
1K-1
0.1
Glass transition temperature, ASTM, E228,
°C
120
Electrical Properties
Constant
Loss
Dielectric constant & loss, 25°C, ASTM D150
measured at
100Hz
2.65
<0.02
1kHz
2.75
<0.02
10kHz
2.65
<0.02
Volume resistivity, ASTM D257,
.cm
1 x 1016
Surface resistivity, ASTM D257,
1 x 1016
Dielectric strength, ASTM D149, kV/mm
25
PERFORMANCE OF CURED MATERIAL
(After 24 hr at 22
°C)
Typical
Value
Range
Shear Strength, ASTM D1002/DIN 53283
Grit Blasted Steel, N/mm
22
18 to 26
(psi)
(3200)
(2600 to 3800)
Etched Aluminium, N/mm
15
11 to 19
(psi)
(2200)
(1600 to 2800)
Zinc dichromate, N/mm
7
4 to 10
(psi)
(1000)
(600 to 1450)
ABS, N/mm
13
6 to 20
(psi)
(1900)
(900 to 3000)
PVC, N/mm
13
6 to 20
(psi)
(1900)
(900 to 3000)
Polycarbonate, N/mm
12.5
5 to 20
(psi)
(1800)
(700 to 3000)
Phenolic, N/mm
10
5 to 15
(psi)
(1450)
(700 to 2200)
Neoprene rubber, N/mm
10
5 to 15
(psi)
(1450)
(700 to 2200)
Nitrile rubber, N/mm
10
5 to 15
(psi)
(1450)
(700 to 2200)
Tensile Strength, ASTM D2095, DIN
53282
Grit Blasted Steel, N/mm
18.5
12 to 25
(psi)
(2700)
(1700 to 3600)
Buna N rubber, N/mm
10
5 to 15
(psi)
(1450)
(700 to 2200)
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