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參數(shù)資料
| 型號： | 1470001-1 |
| 元件分類： | 插座 |
| 英文描述： | PGA423, IC SOCKET |
| 文件頁數(shù)： | 1/1頁 |
| 文件大?。?/td> | 115K |
| 代理商： | 1470001-1 |
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1470001-1 Product Details
Product View
1470001-1
T E I nternal N umber: 1 4 7 0 0 0 1 -1
PGA Sockets
Product Highlights:
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Zero Insertion Force
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Number of Positions = 423
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PCB Mount Style = Through Hole
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Grid Size = 20x20
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Grid Spacing = Interstitial: 1.27 x 2.54 mm
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Documentation & Additional Information
Product Drawings:
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None Available
Catalog Pages/Data Sheets:
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None Available
Product Specifications:
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None Available
Application Specifications:
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None Available
Instruction Sheets:
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None Available
CAD Files:
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None Available
Additional Information:
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Related Products:
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Product Features (Please use the Product Drawing for all design activity)
Product Type Features:
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Insertion Force = Zero
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Number of Positions = 423
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PCB Mount Style = Through Hole
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Grid Size = 20x20
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Grid Spacing (mm [in]) = Interstitial: 1.27 x 2.54 [.050 x .100]
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Chip Compatibility = Intel? Pentium? 4 (423 pattern)
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Frame Style = Open
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Heat Sink Attachment = With
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Heat Sink Style = Universal
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ZIF Actuator = Single Lever
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Profile = Standard
Termination Related Features:
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Termination Post Length (mm [in]) = 2.36 [0.093]
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Socket Identifier = 423 Pin Socket
Body Related Features:
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Assembly Process Feature = None
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Socket Overall Height (mm [in]) = 5.46 [0.215]
Contact Related Features:
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Contact Style = Stamped + Formed
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Contact Base Material = Phosphor Bronze
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Contact Mating Area Plating Material = Gold Flash
Housing Related Features:
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Housing Material = High Temperature Thermoplastic
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Housing Flammability Rating = UL 94V-0
Industry Standards:
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RoHS/ELV Compliance = ELV compliant, 5 of 6 Compliant
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Lead Free Solder Processes = Wave solder capable to 240?C
Operation/Application:
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Application = Production
Packaging Related Features:
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Packaging Method = Tray
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Packaging Quantity = 90 sockets/box
Other:
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Brand = AMP
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
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| 147-0003 | 制造商:SPC Multicomp 功能描述:TAPE QUADROFLEX 10M |
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